Immersed Liquid Cooling Flow Equalization for Stable Temperatures
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Solution Overview
Problem
Existing blockchain servers face challenges with inconsistent flow distribution in immersion-type single-phase liquid cooling, leading to large temperature differences and high temperatures in certain areas, which affect overall heat dissipation efficiency.
Innovation Solution
An immersed liquid cooling system with flow-equalizing plates and a cooling circulation device that includes flow-equalizing holes of varying sizes and configurations to ensure consistent fluid flow across computing devices, combined with a temperature control mechanism using a PID thermostat and multiple cooling assemblies to maintain stable temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If immersion-type single-phase liquid cooling is used, then heat dissipation efficiency is improved, but flow distribution consistency deteriorates
Solution Approach 1:
The flow equalizing plate implements local quality by having different hole densities in different regions. The plate includes a first region with a first hole density and a second region with a second hole density, where the hole densities differ to compensate for varying flow path resistances in different areas of the cooling system. This ensures consistent flow distribution across all heat dissipation modules while maintaining high heat dissipation efficiency.
2Use of energy by moving object
If flow rate is reduced in certain areas, then energy consumption is lowered, but temperature control deteriorates
Solution Approach 1:
The flow equalizing plate uses local quality by implementing region-specific hole densities. The first region has a higher hole density to increase flow rate where resistance is high, while the second region has a lower hole density where resistance is already low. This balanced approach ensures uniform temperature control across all modules without excessive energy consumption, as each region receives appropriate flow based on its specific requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves uniform temperature distribution and improved heat dissipation performance, enhancing computing power and energy efficiency while reducing power consumption and ensuring consistent operation across different seasons and geographical locations.
Implementation Method 1
a flow-equalizing plate having a plurality of flow-equalizing holes... adjacent flow-equalizing plates are snap-fitted with each other... the flow-equalizing holes are configured to ensure consistent fluid flow across computing devices
Implementation Method 2
The frame has a plurality of liquid-through ports for immersed heat dissipation... The liquid cooling module comprises liquid oil inlets and a liquid oil outlet
Implementation Method 3
The computing devices to be cooled are arranged on the flow-equalizing plates... for immersed heat dissipation
Implementation Method 4
a cooling circulation device... combined with a temperature control mechanism using a PID thermostat and multiple cooling assemblies to maintain stable temperatures
Data Source
AI summary
Disclosed is an immersed liquid cooling heat dissipation system, which comprises a liquid cooling module, an oil path circulation device, and a plurality of computing devices to undergo heat dissipation. Each computing device comprises a frame, a control module, a power module, and computing modules. The liquid cooling module comprise a first device slot tank, a second device slot tank, a return flow slot tank, and a flow-equalizing plate. The return flow slot tank is located between the first device slot tank and the second device slot tank, wherein the flow-equalizing plate is disposed in the first device slot tank and the second device slot tank, and the computing devices are disposed on the flow-equalizing plate. The frame is internally provided with a power module accommodating region used for accommodating the power module and a computing module accommodating region used for accommodating the computing module.