Immersion Cooling System With Boiling Device
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Solution Overview
Problem
Current electronic device cooling systems face challenges in maintaining efficient cooling across diverse heat-generating components due to limitations in vaporization temperatures, complex mechanisms, and low secondary cooling efficiency, leading to reduced maintainability and overall cooling performance.
Innovation Solution
A cooling system that employs a boiling cooling device with a first cooling liquid of 100°C or lower boiling point, immersed in a second cooling liquid of 150°C or higher boiling point, and a third refrigerant with a lower boiling point, allowing for triple cooling through local boiling, liquid immersion, and surface heat exchanger mechanisms, simplifying the system and improving cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a fluorocarbon-base cooling liquid with low boiling point is used for vaporization cooling, then cooling efficiency is improved through latent heat utilization, but thermal insulation films form on heating surfaces reducing heat conduction capability
Solution Approach 1:
The patent changes the boiling point parameter of the cooling liquid from low (100°C or lower) to high (150°C or higher). This parameter change prevents bubble formation on heating surfaces while still utilizing vaporization heat for cooling, thereby eliminating thermal insulation film formation and maintaining heat conduction capability.
Solution Approach 2:
The patent utilizes the phase transition (vaporization) of high-boiling-point cooling liquid to achieve cooling. The liquid vaporizes at temperatures above 150°C, absorbing latent heat from the heating element, but due to the high boiling point, bubbles do not form on the heating surface, avoiding thermal insulation film formation.
2Temperature
If a boiling cooling device with complex piping and sealed structures is used, then local cooling performance is improved, but system complexity and maintenance difficulty increase
Solution Approach 1:
The patent merges the boiling cooling device with the liquid immersion cooling system by immersing the boiling cooling device in the high-boiling-point cooling liquid. This integration eliminates the need for complex sealed structures and piping, as the cooling liquid directly contacts both the heating element and the boiling cooling device, simplifying the overall system.
Solution Approach 2:
The high-boiling-point cooling liquid serves multiple functions: it acts as the immersion cooling medium for overall heat dissipation and simultaneously as the working fluid for the boiling cooling device's vaporization cycle. This multi-functionality reduces the need for separate cooling systems and complex piping.
3Device complexity
If a single cooling liquid with fixed boiling point is used, then system simplicity is maintained, but cooling efficiency for diverse heat-generating components with different temperatures is reduced
Solution Approach 1:
The patent applies local quality by using a high-boiling-point cooling liquid (150°C or higher) that can effectively cool high-temperature components through vaporization, while the same liquid also provides immersion cooling for lower-temperature peripheral components. The high boiling point ensures vaporization occurs only at the hottest spots, providing localized cooling where needed most.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling performance by effectively cooling both primary and peripheral components, simplifies the system design, and reduces maintenance complexity by eliminating the need for sealed structures and complex piping, while maintaining efficient cooling of peripheral components.
Implementation Method 1
utilizing vaporization heat (latent heat) for the cooling of electronic devices. Then, by utilizing the vaporization heat (latent heat) when the cooling liquid is vaporized by the heat generation on elements mounted on the electronic device
Implementation Method 2
utilizing vaporization heat (latent heat) for the cooling of electronic devices
Implementation Method 3
a cooling tank containing a second cooling liquid having a boiling point T2 (T2=T1 or T2>T1) being the same as the boiling point T1 of the first cooling liquid or being higher than the boiling point T1 of the first cooling liquid wherein the boiling cooling device and the electronic device are immersed in the second cooling liquid to be cooled directly
Implementation Method 4
a cooling liquid is enclosed in a tabular receptacle with a special flow passage wall defined inside, wherein a heat receiving region of the tabular receptacle is thermally connected to a heating element while a heat radiation region of the tabular receptacle is connected to a heat radiation section such as a radiating fin or the like
Implementation Method 5
a first heat exchanger enclosing a third refrigerant having a boiling point T3 (T3=T1 or T3<T1) being the same as the boiling point T1 of the first cooling liquid or being lower than the boiling point T1 of the first cooling liquid and immersed in a surface layer portion of the second cooling liquid in the cooling tank
Data Source
AI summary
Provided is a cooling system capable of improving the cooling performance of an electronic device and being simple and efficient. The cooling system has a cooling tank, and the cooling tank contains in its open space a second cooling liquid having a boiling point T2. An electronic device mounting a processor as a heating element on a board is stored within the open space of the cooling tank and is immersed in the second cooling liquid. A boiling cooling device is a cooling device thermally connected to the processor and encloses a first cooling liquid having a boiling point T1 (provided T1=T2 or T1<T2). A first heat exchanger is immersed in a surface layer portion of the second cooling liquid within the cooling tank. The first heat exchanger encloses therein a third refrigerant having a boiling point T3 (provided T1=T3 or T1>T3).