Immersion Cold Plate with Variable Fin Spacing for Hot Spot Cooling
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Solution Overview
Problem
Modern Information Handling Systems (IHS) face challenges in heat dissipation due to increasing component density, where traditional fan cooling methods are insufficient, and existing liquid cooling techniques, such as immersion cooling and Direct Contact Liquid Cooling, require improvements to effectively manage heat generated by high-power components like CPUs and GPUs.
Innovation Solution
The implementation of an immersion cold plate system with a base having parallel fins and a cover that allows a cooling liquid to flow from an inlet to an outlet between the fins, optimized by varying fin spacing and width to enhance heat exchange near hot spots within IHS components, such as CPUs and GPUs, and configured for immersion in a liquid coolant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional fan cooling methods are used, then device complexity is reduced, but heat dissipation capability is insufficient for high-power components
Solution Approach 1:
The patent applies liquid cooling through a cold plate with fluid passages that circulate coolant through the base and fins. This hydraulic system replaces fan-based pneumatic cooling, providing superior heat dissipation capability for high-power components while managing the complexity through an integrated liquid cooling architecture.
Solution Approach 2:
The cold plate is segmented into multiple fins that extend from the base, creating multiple heat exchange surfaces. This segmentation increases the effective heat dissipation area and improves thermal management for high-power components without requiring a complete system redesign.
2Power
If uniform fin spacing is used, then manufacturing precision is improved, but heat exchange efficiency near hot spots is reduced
Solution Approach 1:
The patent implements non-uniform fin spacing where fins are positioned closer together near hot spots and farther apart in cooler regions. This local quality variation optimizes heat exchange efficiency at critical locations while maintaining manufacturability through controlled spacing variations rather than perfect uniformity.
3Productivity
If increased component density is implemented, then productivity is improved, but heat dissipation challenges increase
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat exchange by extending fins vertically from the base. This dimensional change provides additional heat transfer surfaces in the vertical direction, enabling effective heat dissipation for high-density component configurations without increasing footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively increases the heat exchange operation adjacent to hot spots in IHS components, potentially reducing the need for high-speed fans and extending the capabilities of liquid-cooled systems by efficiently dissipating heat through optimized fin configurations and liquid flow.
Implementation Method 1
a cover configured to allow a liquid to travel from an inlet to an outlet along the base and between the plurality of fins
Implementation Method 2
heat exchange operation adjacent to a hot spot of the one or more IHS components
Implementation Method 3
a base having a plurality of fins disposed in parallel... increase a heat exchange operation adjacent to a hot spot
Data Source
AI summary
Immersion cold plates are described. In some embodiments, a cold plate may include a base having a plurality of fins disposed in parallel and a cover having a cavity configured to house the plurality of fins, where the cover is configured to allow a liquid to travel from an inlet to an outlet along the base and between the plurality of fins.