Immersion-Cooled Electronic Assembly With Sealed Device Packaging
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Solution Overview
Problem
Conventional cooling designs for high-performance computing systems face inefficiencies in space utilization and cooling performance, particularly in high-density computing scenarios, and require compromises in circuit design and coolant layout, leading to increased costs and manufacturing defects.
Innovation Solution
An electronic assembly with a housing, intermediate plate, inlet and outlet pipes, and lead-wires, where electronic devices are sealed and immersed in coolant, allowing for localized immersion cooling without altering circuit design, using a simple structure to enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional cold plate cooling solutions are used, then the cooling system can be implemented with a simple structure, but the cooling efficiency is lower and space utilization is poor in high-density computing scenarios
Solution Approach 1:
The patent applies liquid coolant flow through channels formed directly in the housing to achieve immersion cooling of electronic devices. This hydraulic approach allows the coolant to directly contact and cool the devices, significantly improving cooling efficiency compared to conventional cold plate solutions while maintaining structural simplicity through integrated channel design
2Reliability
If immersion cooling solutions are used to improve cooling efficiency, then cooling performance is enhanced, but the circuit design and coolant layout require compromises and additional changes
Solution Approach 1:
The patent merges the housing structure with the coolant flow channels, integrating the cooling system directly into the existing housing rather than adding separate coolant pathways. This integration eliminates the need for additional coolant layout planning and circuit design modifications, achieving immersion cooling without increasing device complexity
Solution Approach 2:
The housing serves multiple functions: it encloses the electronic devices, provides structural support, and simultaneously acts as the coolant flow path through integrated channels. This multi-functionality eliminates the need for separate cooling components and simplifies both circuit design and coolant layout
3Productivity
If high-density computing systems are implemented, then computational density is improved, but heat generation increases significantly in small volumes creating cooling challenges
Solution Approach 1:
The patent uses liquid coolant flowing through channels to directly remove heat from high-density electronic devices. The hydraulic cooling system efficiently transfers heat from the compact high-density configuration, enabling high computational density without excessive temperature rise
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves superior cooling efficiency for sealed electronic devices, reducing system complexity and assembly costs while maintaining effective cooling without the need for additional coolant pathways or circuit redesign.
Implementation Method 1
Each electronic device is in a sealed package form and immersed in the coolant
Implementation Method 2
the inlet pipe and the outlet pipe being respectively formed to penetrate the wall portion and configured to introduce a coolant into the chamber and discharge the coolant from the chamber
Data Source
AI summary
An electronic assembly for installing electronic devices includes a housing, an intermediate plate, an inlet pipe, an outlet pipe, and a plurality of lead-wires. The housing has a wall portion which circumscribes and defines a hollowed chamber. The intermediate plate is provided within the chamber and is fixed to the wall portion, with the electronic devices being fixed to and electrically coupled with the intermediate plate. The inlet pipe and the outlet pipe are respectively formed to penetrate the wall portion and configured to introduce a coolant into the chamber and discharge the coolant from the chamber. At least one of the electronic devices and the intermediate plate is electrically coupled to an exterior of the housing through the plurality of lead-wires. Each electronic device is in a sealed package form and immersed in the coolant.