Immersion-Cooled Electronic Package With Manifold Flow Paths
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Solution Overview
Problem
Existing heat removal technologies for electronic devices, such as heat sink fins, single-phase liquid cooling, and two-phase liquid cooling, are inadequate for high-power applications where multiple components need cooling at multiple surfaces.
Innovation Solution
An electronics package utilizing a manifold housing for direct immersion in a dielectric cooling fluid, with circuit boards arranged to form cooling fluid flow paths and gaps to control fluid velocity, and enhanced heat transfer technologies applied to power circuit boards to manage heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat sink fins or single-phase liquid cooling is used, then the cooling system is simple to implement, but it cannot effectively cool multiple components at multiple surfaces in high-power applications
Solution Approach 1:
The patent combines multiple cooling functions into a single integrated manifold housing that serves as both the cooling distribution system and the structural enclosure. The manifold housing integrates multiple inlet ports, outlet ports, and internal flow passages to simultaneously cool multiple circuit boards at multiple surfaces, eliminating the need for separate cooling components and reducing overall system complexity while improving temperature control effectiveness.
Solution Approach 2:
The manifold housing performs multiple functions simultaneously: it serves as the cooling fluid distribution system, the structural enclosure for the electronics package, and the mounting structure for circuit boards. This multi-functionality allows effective cooling of multiple components without proportionally increasing system complexity, as the same structure accomplishes several tasks.
2Volume of stationary object
If circuit boards are closely arranged to maximize space utilization, then the package density is improved, but the cooling fluid flow paths and heat dissipation efficiency are reduced
Solution Approach 1:
The patent creates localized cooling channels and flow passages within the manifold housing that are specifically positioned to target heat-generating components on each circuit board. The cooling fluid flow paths are designed to pass over specific areas of the circuit boards where heat dissipation is most critical, allowing efficient heat removal while maintaining compact board arrangement. Different regions of the cooling system can have different flow characteristics optimized for local heat loads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools high-power electronic components by directly transferring heat to the cooling fluid, ensuring they operate within maximum temperature thresholds.
Implementation Method 1
directly transferring heat to the cooling fluid
Implementation Method 2
liquid cooling
Data Source
AI summary
An electronics package includes a manifold housing defining an enclosure and including an inlet port fluidly coupled to an inlet manifold, an outlet port fluidly coupled to an outlet manifold, a first inlet, a second inlet, a third inlet, and a fourth inlet, each fluidly coupled to the inlet manifold and the enclosure, and a first outlet, a second outlet, a third outlet, and a fourth outlet, each fluidly coupled to the outlet manifold and the enclosure. The electronics package also includes a first circuit board coupled to the manifold housing, and a second circuit board coupled to the manifold housing such that the second circuit board is offset from the first circuit board by a first gap. The electronics package further includes a third circuit board coupled to the manifold housing such that the third circuit board is offset from the second circuit board by a second gap.