Immersion-Cooled Semiconductor Package With Sealed Leadframe Exits
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Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently managing heat and protecting semiconductor die from environmental factors while maintaining compactness and reducing manufacturing costs.
Innovation Solution
The implementation of a semiconductor package design that includes one or more semiconductor die directly coupled to a direct leadframe attach (DLA) leadframe with two or more leads, a coating covering the die and leadframe, and mold compound forming a seal around the leads, allowing for immersion cooling with a dielectric coolant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional semiconductor packages use separate heat sinks and bonding processes, then thermal management is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the heat sink function directly into the leadframe structure, eliminating the need for separate heat sink components and bonding processes. The leadframe serves dual purposes as both electrical interconnect and thermal management component, directly addressing the contradiction by merging previously separate functions into a single integrated structure.
Solution Approach 2:
The leadframe is designed to perform multiple functions simultaneously: electrical connection, mechanical support, and heat dissipation. This multi-functional design eliminates the need for additional dedicated heat sink components, thereby reducing device complexity while maintaining effective thermal management.
2Temperature
If traditional semiconductor packages use separate heat sinks and bonding processes, then thermal management is achieved, but manufacturing cost increases
Solution Approach 1:
By integrating the heat sink function into the leadframe, the patent eliminates additional manufacturing steps such as separate heat sink attachment and bonding processes. This consolidation reduces manufacturing complexity and cost while maintaining effective thermal management capabilities.
3Ease of manufacture
If semiconductor die are directly coupled to leadframe without additional components, then manufacturing cost is reduced, but protection from environmental factors may be compromised
Solution Approach 1:
The patent employs a molding compound that encapsulates the semiconductor die and leadframe assembly, providing environmental protection while maintaining a compact structure. This thin film-like encapsulation protects against humidity and other environmental factors without requiring additional bulky protective components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat transfer efficiency by allowing direct contact between the semiconductor die and a dielectric coolant, reduces the need for additional thermal components, and lowers manufacturing costs by eliminating the requirement for separately bonded heat sinks and seals.
Implementation Method 1
a coating covering the one or more semiconductor die and the DLA leadframe where when the semiconductor package is coupled into an immersion cooling enclosure, the coating may be in contact with a dielectric coolant
Implementation Method 2
Mold compound may be molded around the two or more leads and the mold compound may form a seal for the dielectric coolant
Implementation Method 3
The package may include a heat spreader coupled to the one or more semiconductor die. The heat spreader may include pin fins.
Implementation Method 4
when the semiconductor package is coupled into an immersion cooling enclosure, the coating may be in contact with a dielectric coolant
Data Source
AI summary
Implementations of a semiconductor package may include one or more semiconductor die directly coupled to only a direct leadframe attach (DLA) leadframe including two or more leads; and a coating covering the one or more semiconductor die and the DLA leadframe where when the semiconductor package is coupled into an immersion cooling enclosure, the coating may be in contact with a dielectric coolant while the two or more leads extend out of the immersion cooling enclosure.