Liquid Immersion Cooling for High-Density Electronic Storage
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Solution Overview
Problem
There is a need for electronic devices in liquid immersion cooling systems to enhance processing capabilities and packaging density by installing multiple processors and storage devices in a limited volume, while maintaining high efficiency and maintainability.
Innovation Solution
The design includes a cooling apparatus with a tank divided into housing parts, where electronic devices are immersed in coolant, featuring a base board with multiple processors and storage substrates, and a backplane for connector connections, allowing for high-density mounting and efficient cooling, along with a simple sealing structure for maintainability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple processors and storage devices are installed in a limited volume to enhance processing capabilities and packaging density, then the packaging density and processing capability are improved, but the heat generation increases and cooling becomes more difficult
Solution Approach 1:
The patent employs liquid immersion cooling where electronic devices are fully submerged in a cooling liquid. The liquid coolant flows through and around the high-density packed processors and storage devices, efficiently carrying away heat through convection and conduction, thus enabling high packaging density without thermal overload
Solution Approach 2:
The patent changes the cooling medium from gas (air cooling) to liquid (immersion cooling), which fundamentally alters the heat transfer parameters. Liquid coolant provides superior thermal conductivity and heat capacity compared to air, enabling effective cooling of densely packed components that would otherwise overheat
2Loss of energy
If liquid immersion cooling is used instead of air cooling, then cooling efficiency is improved, but the complexity of the cooling system and maintenance requirements increase
Solution Approach 1:
The cooling liquid is designed to be self-circulating through the system, utilizing natural convection currents created by temperature differences. The liquid absorbs heat from hot components, rises, releases heat at cooler regions, and naturally returns to continue the cycle, eliminating the need for complex pumps and control systems
Solution Approach 2:
The patent uses fluorocarbon-based coolant which creates an inert environment that prevents oxidation and corrosion of electronic components. This inert liquid atmosphere protects the electronics while providing efficient heat transfer, simplifying maintenance compared to air cooling systems that require filtration and drying
3Quantity of substance
If more storage devices are installed to improve storing capacity, then the packaging density and storage capacity are improved, but the power consumption increases
Solution Approach 1:
The immersion cooling system enables higher storage device density by efficiently removing heat from multiple storage units. The liquid coolant directly contacts the storage devices, providing superior heat transfer that allows more drives to be packed in the same space without proportionally increasing power consumption for cooling infrastructure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables stable operation of high-density processor and storage units with improved cooling efficiency and maintainability, reducing power consumption and increasing performance in data centers.
Implementation Method 1
electronic device immersed in the coolant filled in a cooling apparatus so as to be directly cooled
Implementation Method 2
an inflow opening and an outflow opening for the coolant... the coolant circulating in the respective housing parts
Data Source
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AI summary
Provided is an electronic device that is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device includes a storage substrate, and a plurality of flash storage units which are mounted on the storage substrate. The flash storage units are arranged on a surface parallel to at least one surface of each of the storage substrates so as to be adjacent one another in a width or a length direction, or in both the width and the length directions of the flash storage unit. The storage substrates are arranged on at least one surface of the base board. The backplane includes a plurality of connectors for electric connection of the respective storage substrates, and is mounted orthogonally onto the one surface of the base board. The flash storage unit may be an M.2 SSD or an mSATA SSD.