Immersion Cooling Adapter Frame for Vertical Server Installation
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Solution Overview
Problem
Traditional server apparatuses are horizontally arranged, making installation in immersion cooling systems laborious and increasing the difficulty of heat dissipation and coolant loss, while requiring vertical installation that complicates the process and increases costs.
Innovation Solution
An immersion cooling system with a storage tank, adapter frame, and electronic device configuration that allows vertical placement of electronic devices, featuring a first and second wire channel for power wire connection, facilitating easy installation and reducing coolant loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional horizontal arrangement of server apparatuses is used, then installation in immersion cooling systems is simpler, but heat dissipation performance is compromised and coolant loss increases
Solution Approach 1:
The patent transitions from traditional horizontal arrangement to vertical arrangement of electronic devices in the immersion cooling system. This dimensional change allows the devices to be positioned upright with their heat-generating components oriented vertically, improving heat dissipation efficiency while maintaining installation simplicity through the adapter frame design.
2Reliability
If vertical installation of electronic devices is implemented, then heat dissipation performance improves, but installation difficulty and complexity increase
Solution Approach 1:
The adapter frame serves as an intermediary component between the electronic device and the immersion cooling system. It provides a standardized interface that simplifies the vertical installation process, allowing electronic devices to be easily mounted in the vertical position while maintaining good heat dissipation performance.
3Reliability
If vertical installation is adopted, then heat dissipation improves, but coolant loss increases
Solution Approach 1:
The patent designs the liquid level in the immersion cooling system to be higher than the highest point of the vertically arranged electronic devices. This creates an equipotential condition where the coolant continuously covers the devices, preventing vaporization and reducing coolant loss while maintaining effective heat dissipation.
Data Source
Figure 1
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Figure 3A
AI summary
An immersion cooling system is provided and includes a storage tank (110) comprising a sealing cover (111) and an accommodating tank (112), and the sealing cover is configured to seal an opening (1121) of the accommodating tank; an adapter frame (120) comprising a first wire channel (121), wherein the first wire channel is attached to one side of the adapter frame, and the adapter frame is disposed in the accommodating tank in a direction perpendicular to a bottom of the accommodating tank; and an electronic device (130) comprising at least one power wire (131), wherein the electronic device is inserted into the adapter frame along the direction, and one side of the electronic device is attached to one side of the first wire channel, wherein a distance is formed between a bottom of the electronic device and a bottom of the adapter frame to form a second wire channel (122), and the first wire channel and the second wire channel communicate with each other, The power wire is connected to the circuit of the external power apparatus along the first and second wire channels.