Immersion Cooling Module Airflow Guiding Device
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Solution Overview
Problem
High-performance servers generate significant waste heat, leading to increased maintenance costs due to the potential escape of expensive heat dissipation liquids when gasified, and existing two-phase immersion cooling technologies are inefficient in condensation and heat dissipation.
Innovation Solution
An electronic apparatus with an immersion cooling module that includes a condensing structure and an airflow guiding device, which seals the containing space and uses sensors to activate the airflow guiding device when temperature or pressure thresholds are exceeded, forcing gaseous heat dissipation medium to the condensing structure to prevent escape and enhance condensation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If two-phase immersion cooling technology is used, then heat dissipation capability is improved, but heat dissipation liquid may escape to the outside increasing maintenance cost
Solution Approach 1:
The patent applies preliminary anti-action by providing a sealing structure that prevents heat dissipation liquid from escaping before it can cause damage. The sealing structure includes a seal ring that fits between the condensing structure and the box body, creating a barrier that stops liquid leakage in advance, thus protecting against the harmful effect of expensive heat dissipation liquid loss while maintaining effective heat dissipation
2Use of energy by moving object
If heat dissipation liquid is gasified, then heat absorption is improved, but condensation efficiency is insufficient
Solution Approach 1:
The patent applies segmentation by dividing the condensing structure into multiple condensing tubes arranged in parallel. This segmented structure increases the total condensation surface area, allowing more efficient condensation of the gasified heat dissipation liquid. The multiple tubes provide distributed condensation pathways, improving overall condensation efficiency while maintaining effective heat absorption during the gasification phase
Solution Approach 2:
The patent applies dimensionality change by extending the condensing structure vertically with multiple condensing tubes arranged in different spatial positions. This three-dimensional arrangement maximizes the use of vertical space within the box body, increasing the condensation surface area without expanding the horizontal footprint, thus improving condensation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents heat dissipation medium from escaping, increases condensation efficiency, and improves the heat dissipation capability of the electronic apparatus by forcibly guiding gaseous heat dissipation medium to the condensing structure, thereby reducing maintenance costs and enhancing thermal management.
Implementation Method 1
the heat dissipation liquid is adapted to be gasified into a gaseous heat dissipation medium through the thermal energy of the heat generating element
Implementation Method 2
the heat dissipation liquid is gasified and condensed on the condensing pipeline
Implementation Method 3
the airflow guiding device is adapted to guide the gaseous heat dissipation medium toward the first condensing portion
Data Source
AI summary
An electronic apparatus including a box body, at least one heat generating element and an immersion cooling module are provided. The immersion cooling module includes a condensing structure and an airflow guiding device. The box body has a containing space, and the containing space is adapted to contain a heat dissipation medium. The heat generating element is disposed in the containing space to be immersed in the heat dissipation medium which is in the liquid state. The condensing structure is disposed in the containing space and includes a first condensing portion. The airflow guiding device is disposed in the box body and is adapted to guide the heat dissipation medium which is in the gaseous state toward the first condensing portion.