Immersion Cooling Vapor Chamber for Air Bubble Removal
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Solution Overview
Problem
Existing heat dissipation devices for electronic components face challenges in efficiently managing air bubbles and reducing flow resistance and pressure drop during the cooling process, which affects heat dissipation efficiency.
Innovation Solution
An immersion cooling device with a fin portion having an outlet section configured to reduce air bubble accumulation and enhance fluid flow by incorporating a cavity and inclined structure, along with microfluidic channels and piercing structures to facilitate smooth condensation and circulation of the cooling fluid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional heat dissipation devices are used, then heat can be dissipated from electronic components, but air bubbles accumulate and cause increased flow resistance and pressure drop
Solution Approach 1:
The patent extracts and removes air bubbles from the cooling system through a dedicated outlet section that separates gas phase from liquid phase. The outlet section provides a preferential escape path for air bubbles, extracting them from the circulation loop before they can accumulate and cause harmful effects on heat dissipation efficiency.
Solution Approach 2:
The patent converts the harmful effect of air bubbles into a beneficial separation process. By designing the outlet section with specific geometric features, the system utilizes the natural buoyancy and phase difference between air bubbles and cooling fluid to achieve automatic separation, turning what was previously a harmful accumulation into a controlled removal mechanism.
2Temperature
If cooling fluid circulates through the system, then heat is dissipated, but flow resistance and pressure drop increase due to air bubble accumulation
Solution Approach 1:
The outlet section extracts air bubbles from the cooling fluid circulation path, removing the source of increased flow resistance. This extraction mechanism prevents pressure drop accumulation and maintains stable fluid flow conditions throughout the heat dissipation system.
3Ease of manufacture
If the outlet section is designed with traditional structure, then manufacturing is simple, but air bubble removal is inefficient
Solution Approach 1:
The outlet section employs local quality changes through its multi-level stepped structure and inclined surfaces. These localized geometric features are strategically positioned to create specific flow conditions that enhance air bubble separation and removal efficiency, while the overall structure remains manufacturable using conventional processes.
Solution Approach 2:
The patent introduces dimensional complexity through the multi-level stepped structure and inclined surfaces in the outlet section. By utilizing vertical and angular dimensions rather than simple linear configurations, the design creates multiple flow paths and separation zones that significantly improve air bubble removal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device significantly reduces air bubble accumulation by 80%, thereby improving heat dissipation efficiency by minimizing flow resistance and pressure drop, ensuring effective heat management.
Implementation Method 1
the liquid cooling fluid absorbs the heat generated by the electronic components and produces a phase change, so that the liquid cooling fluid evaporates into a gaseous cooling fluid that helps to carry away the heat generated by the electronic components
Implementation Method 2
the liquid cooling fluid evaporates into a gaseous cooling fluid that helps to carry away the heat
Implementation Method 3
the covering portion forms a vapor chamber around the fin portion
Data Source
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AI summary
An immersion cooling device for dissipating heat includes a base portion having a heat absorbing surface and a heat dissipating surface, a fin portion that is arranged on the heat dissipating surface of the base portion, and a covering portion that forms a vapor chamber around the fin portion on the base portion. The covering portion can include a liquid inlet channel and a liquid outlet channel that are connected to the vapor chamber. Further, the fin portion can include an inlet section that is located adjacent to the liquid inlet channel and an outlet section that is located adjacent to the liquid outlet channel, and a cavity that is formed over the outlet section.