Immersion Cooling Circuit Card Temperature Control
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Solution Overview
Problem
Existing cooling methods for superconducting supercomputers face challenges in achieving temperature differentials between 4K and 77K regions, leading to high thermal parasitic loads, power consumption, and design infeasibility due to long signal paths and additional components.
Innovation Solution
A circuit card apparatus with longitudinally spaced subassemblies connected by a card connector, utilizing thermal energy transfer devices to induce different operating temperatures and minimize thermal parasitic heat transfer through immersion cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If dewars are used for each cryogenic temperature (4K and 77K), then the desired operating temperatures are achieved, but thermal parasitic load increases and signal latency increases due to long cable paths
Solution Approach 1:
The circuit card is divided into multiple temperature zones (4K zone and 77K zone) with distinct subassemblies, allowing each zone to be cooled independently at its required temperature without thermal interference, thus reducing thermal parasitic load while maintaining desired operating temperatures
Solution Approach 2:
A thermally isolating structure (intermediary) is introduced between the 4K and 77K zones to block thermal parasitic heat transfer while allowing signal transmission, thereby achieving temperature differential without excessive thermal load
2Temperature
If dewars with cabling are used to connect 4K and 77K regions, then temperature control is achieved, but signal latency increases and additional components are required
Solution Approach 1:
The system is segmented into temperature zones with local cooling, eliminating the need for long interconnecting cables between 4K and 77K regions, thus reducing signal latency and removing the requirement for additional compensating components
Solution Approach 2:
The patent transitions from a cable-based connection approach (one-dimensional signal path) to a direct integrated card assembly approach (multi-dimensional spatial arrangement), allowing signals to travel shorter paths while maintaining thermal isolation
3Device complexity
If a cryocooler is used for both temperatures in small scale applications, then the two temperature sides are brought closer together, but the solution is not scalable to large applications
Solution Approach 1:
The cooling system is segmented into independent temperature zone modules that can be individually configured and scaled, allowing the system to adapt from small to large applications by adding or removing modules rather than relying on a fixed cryocooler configuration
Solution Approach 2:
The circuit card design incorporates universal thermal management features that can accommodate different cooling approaches (dewars or crycoolers) and scale to various application sizes, making the system adaptable and versatile across different deployment scenarios
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides efficient temperature-differential environments with reduced thermal parasitic heat transfer and signal latency, enabling scalable cooling solutions for large-scale supercomputing applications.
Implementation Method 1
A thermal energy transfer device operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies induces the respective one of the first and second operating temperatures to the selected circuit card subassembly
Implementation Method 2
minimize thermal parasitic heat transfer
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.