Immersion Cooling Condenser Layout for High-Heat Electronics Racks
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Solution Overview
Problem
Current cooling methods for rack-mounted electronic units, such as server units, face challenges in managing increased heat dissipation due to the rising power consumption of integrated circuit chips, particularly in large server applications where air cooling becomes inefficient, leading to stress on data center air-conditioning systems.
Innovation Solution
A liquid-cooled cooling apparatus with a sealed compartment containing dielectric fluid and thermally conductive condenser fins, along with a filler material that directs vapor towards the condenser fins, is used to immerse electronic components, facilitating efficient heat transfer and condensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air cooling methods are used for rack-mounted electronic units, then the system is simple to implement, but the cooling efficiency becomes insufficient when power dissipation increases
Solution Approach 1:
The patent changes the cooling medium from air to dielectric liquid, fundamentally altering the thermal transfer parameter. This allows direct liquid-to-component contact, achieving superior cooling efficiency while maintaining system simplicity through the use of non-conductive fluid that requires no complex electrical isolation infrastructure
Solution Approach 2:
The system utilizes phase transition of the dielectric liquid (liquid to vapor and back to liquid) as the primary cooling mechanism. The liquid absorbs heat from electronic components, vaporizes, rises to the condenser, condenses back to liquid, and returns to cool components again, creating a continuous passive cooling cycle that is highly efficient
2Productivity
If liquid cooling is implemented to handle higher heat fluxes, then cooling efficiency improves, but the system complexity increases
Solution Approach 1:
The cooling system is designed to be self-regulating through natural convection and phase change. Hot dielectric liquid vapor rises automatically to the condenser due to buoyancy, condenses without mechanical assistance, and the condensed liquid returns to the cooling chamber, eliminating the need for pumps, valves, or complex control systems
Solution Approach 2:
The use of dielectric liquid creates an electrically inert environment that allows direct contact with electronic components without risk of short circuits. This eliminates the need for complex electrical isolation barriers while maintaining high cooling efficiency through direct liquid-to-component thermal contact
3Temperature
If more dielectric fluid is used for immersion cooling, then component cooling effectiveness improves, but the volume and weight of the system increases
Solution Approach 1:
The system exploits the phase transition volume expansion of the dielectric liquid. In liquid form, it provides direct cooling contact with minimal volume. Upon heating, it vaporizes and expands to fill the upper chamber, providing continuous cooling coverage without requiring large amounts of liquid. The phase change enables a small volume of liquid to effectively cool large surface areas
Solution Approach 2:
The system transitions from two-dimensional liquid pooling at the bottom to three-dimensional vapor distribution throughout the chamber. The vapor phase occupies the entire upper volume, ensuring heat dissipation from all exposed component surfaces, while the liquid phase remains minimal at the bottom for continuous replenishment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively manages high heat fluxes without the need for energy-intensive refrigeration, allows for greater component compaction, and reduces the amount of dielectric fluid required, offering energy efficiency and performance benefits over traditional air and water cooling systems.
Implementation Method 1
The liquid absorbs the heat dissipated by the components/modules in an efficient manner
Implementation Method 2
The plurality of thermally conductive condenser fins facilitate cooling and condensing of dielectric fluid vapor rising to the upper portion of the sealed compartment
Implementation Method 3
The plurality of thermally conductive condenser fins facilitate cooling and condensing of dielectric fluid vapor
Implementation Method 4
The filler material includes a shaped surface configured to direct dielectric fluid vapor within the sealed compartment towards the plurality of thermally conductive condenser fins
Data Source
AI summary
Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment, with the electronic subsystem being immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment in an upper portion of the compartment. The condenser fins facilitate cooling of dielectric fluid vapor rising to the upper portion of the compartment. A filler material is disposed within the sealed compartment to reduce the amount of dielectric fluid required within the compartment to achieve immersion-cooling of the electronic subsystem, and the filler material includes a shaped surface to direct dielectric fluid vapor within the compartment towards the condenser fins.