Immersion Cooling for Data Center Servers
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Solution Overview
Problem
Conventional cooling systems for electronic equipment in data centers often fail to adequately cool densely packed or high-power devices, leading to overheating and potential device failure, despite the use of forced convection methods.
Innovation Solution
A data center cooling system utilizing a non-conductive dielectric coolant and immersion cooling with heat transfer devices like heat pipes and vapor chambers, which are in thermal contact with electronic devices and immersed in the coolant, effectively transferring heat from devices to the coolant without conducting electricity, thus preventing operational interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If forced convection cooling is used with fans and ductwork, then cooling airflow can be provided over electronic devices, but difficult-to-cool areas on server trays remain inadequately cooled and devices may overheat
Solution Approach 1:
The patent introduces immersion cooling as an intermediary cooling method where electronic devices are directly immersed in a dielectric coolant fluid. This eliminates the need for forced convection airflow and provides uniform cooling to all device surfaces including difficult-to-cool areas, thereby preventing overheating while maintaining system reliability.
2Temperature
If conventional cooling systems are used, then cooling is provided to electronic devices, but the systems are complex requiring fans, ductwork, and multiple cooling zones
Solution Approach 1:
The patent extracts and eliminates the complex forced convection cooling infrastructure (fans, ductwork, multiple cooling zones) by adopting immersion cooling. The system simplifies cooling to a single fluid-based method that provides uniform cooling throughout the server rack without requiring complex airflow management or multiple cooling zones.
3Temperature
If liquid coolant is used for immersion cooling, then heat transfer efficiency is improved, but electrical conductivity may interfere with electronic device operation
Solution Approach 1:
The patent changes the electrical parameter of the coolant by using a dielectric (non-conductive) fluid instead of conventional conductive liquid coolants. This parameter change allows the coolant to maintain high heat transfer efficiency while being electrically non-conductive, thus eliminating electrical interference with electronic device operation.
4Temperature
If more coolant is used to improve cooling coverage, then heat dissipation is enhanced, but cost and vapor bleed-off increase
Solution Approach 1:
The patent applies local quality by positioning cooling elements strategically within the immersion cooling system to optimize heat transfer in high-heat-generation zones. This localized cooling approach provides effective cooling coverage without requiring excessive amounts of coolant, thereby reducing coolant loss and associated costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution efficiently cools electronic devices by transferring heat from devices to the coolant, preventing overheating and allowing for denser packing and higher power handling within the same space, while using less coolant and minimizing vapor bleed-off, thus reducing costs and maintaining device operation.
Implementation Method 1
one or more heat transfer devices (e.g., heat pipes, three-dimensional vapor chambers) in thermal contact with the heat-generating devices and immersed in the coolant
Implementation Method 2
The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant
Implementation Method 3
an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant
Implementation Method 4
one or more heat transfer devices (e.g., heat pipes, three-dimensional vapor chambers)
Data Source
AI summary
A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.