Immersion Cooling Deflector for Vapor Bubble Control
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Solution Overview
Problem
Traditional air-cooling methods are insufficient for high chip density computing devices, and liquid-cooling methods face challenges with coolant loss due to boiling and evaporation.
Innovation Solution
A flow guiding device for a liquid-cooled chassis, featuring deflectors with hollow parts and through holes, is mounted to the mainboard, guiding vapor bubbles away from the mainboard and reducing coolant loss by controlling the momentum and rising height of vapor bubbles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid-cooling method is used to improve heat dissipation efficiency, then heat transfer capability is improved, but coolant loss occurs due to boiling and evaporation
Solution Approach 1:
The patent converts the harmful effect of vapor bubbles (which cause coolant loss) into a beneficial flow pattern. By strategically positioning deflectors, the vapor bubbles generated during boiling are redirected to follow a controlled path along the deflector surfaces and return to the liquid coolant reservoir, transforming the harmful evaporation into a useful circulation mechanism that enhances heat dissipation while preventing coolant loss.
Solution Approach 2:
The deflectors serve as intermediary elements between the heat-generating chips and the coolant reservoir. These intermediaries guide the phase-change vapor bubbles from the chip surfaces through a controlled trajectory back to the liquid reservoir, mediating the transition from harmful direct evaporation to beneficial indirect circulation.
2Loss of substance
If vapor bubbles rise rapidly to escape, then evaporation occurs causing coolant loss, but if vapor bubbles are slowed down, then heat dissipation efficiency is reduced
Solution Approach 1:
The patent segments the vapor bubble flow path into multiple controlled sections using deflectors positioned at different locations and angles. This segmentation creates a series of controlled interactions between vapor bubbles and deflector surfaces, allowing the system to manage vapor velocity in stages rather than as a single uncontrolled rise, thereby maintaining both coolant retention and heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flow guiding device effectively reduces coolant loss by breaking up and slowing down rapidly rising vapor bubbles, thereby improving the efficiency of heat dissipation in high chip density environments.
Implementation Method 1
the coolant liquid being heated can boil and/or escape through evaporation, which leads to a loss of the coolant liquid
Implementation Method 2
controlling the momentum and rising height of vapor bubbles
Implementation Method 3
breaking up and slowing down rapidly rising vapor bubbles
Implementation Method 4
the condenser is mounted to the container and is located in the vaporized gas area
Data Source
AI summary
A flow guiding device in an immersion-cooled chassis of a server comprises at least one deflector located above a chip on a mainboard in the chassis, each deflector comprises a first end for mounting to the mainboard above the chip and a second end inclined away from the mainboard. The first end is immersed in coolant, the second end is higher than the first end; the deflector further comprises a hollow part including multiple through holes for interrupting upward movement vapor bubbles generated by the hot chip, which reduces probability of the vapor bubbles escaping from the coolant liquid and the chassis. A liquid-cooled chassis having the flow guiding device is also disclosed.