Immersion Cooling System Dynamic Flow Control
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Solution Overview
Problem
Existing liquid coolant circulation systems for immersion cooling do not effectively adjust cooling conditions based on the varying heat output of electronic devices, leading to suboptimal cooling performance.
Innovation Solution
A liquid coolant circulation system with a system control device that adjusts flow rates and temperatures of the coolant based on the operation states of electronic devices, utilizing a heat exchanger and multiple cooling modes to optimize cooling conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the cooling condition is fixed regardless of electronic device heat output, then the system structure is simple, but the cooling performance is suboptimal
Solution Approach 1:
The system dynamically adjusts cooling conditions based on real-time heat output measurements from electronic devices. The control device modifies coolant flow rate and temperature parameters adaptively, transforming a static cooling system into a dynamic one that responds to changing thermal loads, thereby resolving the contradiction between adaptability and complexity.
Solution Approach 2:
The system incorporates feedback mechanisms where the control device receives information about electronic device heat output and adjusts cooling parameters accordingly. This closed-loop control enables the system to adapt to varying thermal conditions while maintaining manageable complexity through automated feedback-based regulation.
2Reliability
If the coolant flow rate is increased to improve cooling performance, then the cooling efficiency increases, but the energy consumption increases
Solution Approach 1:
The system dynamically adjusts coolant flow rate based on actual cooling requirements rather than maintaining a constant high flow rate. The control device optimizes pump operation by matching flow rate to the instantaneous heat output of electronic devices, thereby maintaining high cooling efficiency while minimizing energy consumption during low-load periods.
Solution Approach 2:
The system changes operational parameters (coolant flow rate and temperature) according to the thermal load of electronic devices. By adjusting these parameters dynamically, the system achieves optimal cooling efficiency at each operating point while avoiding the excessive energy consumption associated with fixed high-flow-rate operation.
3Reliability
If the cooling system continuously operates at maximum capacity, then the electronic devices are always cooled adequately, but the power efficiency decreases
Solution Approach 1:
The system transitions from continuous maximum-capacity operation to dynamic operation that matches cooling capacity to actual demand. The control device adjusts cooling parameters in real-time based on electronic device heat output, ensuring adequate cooling is provided only when and where needed, thereby eliminating the waste of energy associated with continuous maximum-capacity operation.
Solution Approach 2:
Instead of applying full cooling capacity continuously (excessive action), the system applies cooling capacity proportionally to the actual thermal load (partial action). The control device modulates cooling parameters to provide exactly the amount of cooling needed, avoiding the energy waste of over-cooling while maintaining adequate cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system ensures proper cooling conditions are set according to the heat output of electronic devices, enhancing performance and power efficiency by dynamically adjusting coolant flow rates and temperatures.
Implementation Method 1
a heat exchanger provided in the liquid coolant circulation path and exchanging heat between the liquid coolant and a cooling medium
Data Source
AI summary
A liquid coolant circulation system that circulates a liquid coolant to an immersion tank for cooling a plurality of electronic devices by immersing the plurality of electronic devices in the liquid coolant, includes: a first flow rate adjustment unit provided in a liquid coolant circulation path for circulating the liquid coolant to the immersion tank; a heat exchanger provided in the liquid coolant circulation path and exchanging heat between the liquid coolant and a cooling medium; a cooling unit that supplies the cooling medium to the heat exchanger; and a system control device that controls the first flow rate adjustment unit and the cooling unit. The cooling unit includes: a cooling part for cooling the cooling medium; and a second flow rate adjustment unit that adjusts a flow rate of the cooling medium.