Immersion Cooling of Electronics Using Fluorinated Olefin Refrigerants
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Solution Overview
Problem
The industry faces a challenge in finding refrigerants with low global warming potential (GWP) that also possess high thermal stability, low toxicity, non-flammability, and effective heat transfer properties, especially for cooling electronic components during manufacture and operation.
Innovation Solution
The use of refrigerant compositions comprising the trans isomer of 1,3,3,4,4,5,5,5-octafluoropent-1-ene (transOFP) and its cis isomer, which offer a combination of desirable properties including low GWP, non-flammability, and effective heat transfer, particularly suitable for immersion cooling of electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a refrigerant with low boiling point is used to achieve effective cooling of electronic components, then the cooling performance is improved, but the heat transfer driving force becomes limited when the boiling point approaches the condensing temperature
Solution Approach 1:
The patent changes the chemical composition parameters of the refrigerant by using fluorinated olefin compounds with specific molecular structures. This allows optimization of the boiling point to be sufficiently low for effective cooling while maintaining an adequate temperature difference for heat transfer. The dielectric constant is also adjusted through chemical composition to enable immersion cooling application.
2Object-affected harmful factors
If a refrigerant with low dielectric constant is used to enable immersion cooling of electronic components, then the electrical insulation is improved, but the selection of suitable refrigerants with low GWP and appropriate boiling point becomes more restricted
Solution Approach 1:
The patent employs composite refrigerant formulations combining fluorinated olefin compounds (such as HFO-1234yf, HFO-1234ze) with other compatible fluorinated substances. This composite approach allows the refrigerant mixture to achieve the required low dielectric constant for electrical insulation while maintaining low GWP and appropriate boiling point characteristics, thereby expanding the available options beyond single-component refrigerants.
3Productivity
If electronic devices are made smaller with higher performance to meet market demands, then the product performance is improved, but the heat transfer challenge increases due to higher power density in smaller packages
Solution Approach 1:
The patent utilizes immersion cooling where the electronic components are directly submerged in the fluorinated olefin refrigerant. This hydraulic approach allows for superior heat transfer compared to conventional air cooling or heat sink methods. The refrigerant circulates around the components, efficiently removing heat from high-power-density devices in compact configurations through direct liquid-to-component contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively manages the temperature of electronic components by providing efficient heat transfer while meeting environmental and safety criteria, thus addressing the challenges of high performance in small packages and the need for low GWP refrigerants.
Implementation Method 1
transferring heat to and/or from the electronic component, article or device by directly or indirectly transferring heat between the electronic component, article or device and a refrigerant fluid
Implementation Method 2
if cooling fluids used for immersion cooling have boiling points less than 40° C. in order to achieve the coolest operating temperature
Data Source
AI summary
Methods of heating and/or cooling of electronic components, articles and/or devices during the manufacture and/or operation thereof comprising: providing an electronic component, article or device which is being manufactured and/or being operated for its intended purpose; and transferring heat to and/or from said electronic component, article and/or device during at least a portion of said manufacturing and/or operating process by directly or indirectly transferring heat between said electronic component, article and/or device and a refrigerant fluid comprising at least 1,3,3,4,4,5,5,5-octafluoropent-1-ene.