Immersion Cooling System With External Condenser
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Solution Overview
Problem
Existing data center cooling systems face challenges in effectively managing the thermal environment for high-power density electronic racks, particularly with immersion cooling, which requires complex infrastructure modifications and disrupts service during maintenance, lacking a comprehensive end-to-end solution for deployment and maintenance.
Innovation Solution
A full-end-to-end immersion cooling system that maintains a coolant level without breaking the cooling loop, allowing active IT equipment operation during maintenance, with a condenser positioned above the IT module and a valve-controlled liquid level system to ensure continuous operation and flexible deployment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional air cooling systems (CRAC units) are used for high-power density racks, then the thermal environment can be maintained for conventional racks, but the system becomes unable to effectively cool high-power density racks due to higher heat generation rates
Solution Approach 1:
The patent transitions from air cooling to liquid immersion cooling, fundamentally changing the cooling medium parameter. The dielectric liquid directly contacts the electronics, enabling much higher heat transfer coefficients and cooling capacity suitable for high-power density racks while maintaining effective temperature control
2Productivity
If immersion cooling is implemented in existing data centers, then high-density electronics can be cooled effectively, but the cooling infrastructure requires significant modifications and the system complexity increases
Solution Approach 1:
The patent divides the data center cooling infrastructure into modular immersion cooling units. Each unit is a self-contained module with its own tank, condenser, and cooling loop, allowing incremental deployment without requiring complete infrastructure overhaul. This segmentation reduces overall system complexity while maintaining effective cooling capability
Solution Approach 2:
The immersion cooling units are designed to be universally applicable in existing data centers without requiring specialized infrastructure. The units can be deployed in various locations and configurations, serving multiple cooling needs while integrating with existing facility structures and power systems
3Productivity
If conventional two-phase immersion cooling systems are used, then high-density electronics can be cooled, but maintenance requires removing the condenser from the tank which breaks the cooling loop and causes service interruption
Solution Approach 1:
The patent extracts the condenser from the immersion tank, separating it into an independent external component. This allows the condenser to be accessed, removed, or serviced without disturbing the electronics in the tank or breaking the cooling loop. The cooling system continues operating during maintenance activities, eliminating service interruptions
Solution Approach 2:
The patent introduces flexible conduits or piping as intermediaries between the tank and condenser. These intermediaries allow the condenser to be positioned externally while maintaining thermal coupling with the cooling system, enabling easy access for maintenance without affecting electronics operation or cooling performance
4Temperature
If single-phase immersion cooling is implemented, then electronics can be cooled, but complex hardware design and mechanical pumps are required which may fail or leak
Solution Approach 1:
The patent replaces mechanical pump systems with passive thermal management mechanisms. The two-phase immersion cooling system uses phase change (evaporation and condensation) of the dielectric liquid to circulate coolant without mechanical pumps, eliminating pump failure and leakage risks while maintaining effective electronics cooling
Solution Approach 2:
The patent utilizes phase transitions of the dielectric liquid (liquid to vapor and back to liquid) as the primary cooling mechanism. The electronics heat the liquid causing it to evaporate, the vapor rises to the condenser where it condenses back to liquid and returns to the tank. This phase change cycle provides reliable, pump-free cooling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables fast, flexible, and low-complexity deployment of immersion cooling, allowing maintenance without service interruption, and can be integrated into existing data centers or deployed as a separate module, ensuring efficient heat management for high-density IT equipment.
Implementation Method 1
Heat generated by the IT equipment is transferred into the liquid coolant while the IT equipment is providing the IT services, thereby causing the liquid coolant to evaporate
Implementation Method 2
a condenser that is positioned above the IT cooling module and that is configured to condense the evaporated coolant back into liquid
Data Source
AI summary
According to one embodiment, an information technology (IT) equipment cooling system includes an IT cooling module having one or more pieces of IT equipment that is configured to provide IT services and is at least partially submerged within a liquid coolant. While the equipment provides the services, heat is generated and transferred into the coolant thereby causing at least some of the coolant to turn into a vapor. The system also includes a condenser that is positioned above the module and is configured to condense the vapor back into liquid coolant. The system includes return and supply lines that are both coupled to the condenser and to the module to create a heat exchanging loop. The system includes an accumulator that is disposed on the supply line and is configured to accumulate the condensed liquid coolant before the coolant is provided to the module. The accumulator provides backup cooling capacity for the system. Also, a data center cooling system includes a cooling region and IT region for deploying a single loop immersion cooling system.