Immersion Cooling Fin Structure for Faster Bubble Exit
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Solution Overview
Problem
Existing heat dissipation devices for electronic components are inefficient in managing air bubbles and pressure drops, leading to reduced heat dissipation efficiency.
Innovation Solution
An immersion cooling device with a fin portion having an outlet section configured with a planar ramp-like structure and a cavity, along with an internal circulation channel and microfluidic channels, to facilitate faster air bubble exit and reduced flow resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional heat dissipation device is used, then the structure is simple, but the air bubble accumulation is high and heat dissipation efficiency is reduced
Solution Approach 1:
The outlet section is segmented into multiple functional zones including a ramp structure with specific inclination angle (0.5-5 degrees), a cavity with optimized volume ratio (1.213), and integrated circulation channels. This segmentation allows different regions to perform specific functions: the ramp facilitates bubble rise, the cavity accumulates and releases bubbles, and the circulation channels manage fluid flow, collectively improving heat dissipation efficiency while maintaining manageable structural complexity
Solution Approach 2:
The invention introduces a three-dimensional cavity structure above the outlet section that extends vertically with optimized height ratios. The cavity's volume-to-outlet-section-volume ratio of 1.213 creates an additional spatial dimension for bubble accumulation and release, enhancing the two-dimensional outlet surface into a three-dimensional bubble management system that significantly reduces air bubble accumulation by 80%
2Speed
If the outlet section is designed with complex structures, then air bubble exit is faster, but the manufacturing difficulty increases
Solution Approach 1:
The invention optimizes specific geometric parameters to balance performance and manufacturability: the ramp inclination angle is set between 0.5-5 degrees (optimally facilitating bubble rise without excessive complexity), the cavity volume ratio is precisely controlled at 1.213, and the circulation channel dimensions are optimized. These parameter optimizations achieve fast bubble exit speed while maintaining manufacturing feasibility through standardized geometric ratios rather than arbitrary complex shapes
Solution Approach 2:
The internal circulation channel and microfluidic channels are designed to leverage fluid dynamics principles, creating optimized flow paths that utilize pressure differentials and buoyancy forces to accelerate bubble removal. The channel geometries are configured to maintain laminar flow patterns that efficiently transport bubbles from high-pressure regions near the heat dissipation surface to the outlet cavity, achieving fast bubble exit through hydrodynamic optimization rather than mechanical complexity
3Loss of energy
If the circulation channel is optimized, then fluid flow resistance is reduced, but the device complexity increases
Solution Approach 1:
The circulation channel is pre-configured with optimized geometry and positioning before operation, creating predetermined low-resistance flow paths. The channel dimensions, bends, and connections are designed in advance to minimize turbulence and pressure losses, allowing the system to achieve low flow resistance without requiring complex active control mechanisms or adaptive structures during operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively reduces air bubble accumulation by 80%, enhancing heat dissipation efficiency through improved fluid flow dynamics.
Implementation Method 1
the liquid cooling fluid absorbs the heat generated by the electronic components and produces a phase change, so that the liquid cooling fluid evaporates into a gaseous cooling fluid that helps to carry away the heat generated by the electronic components
Implementation Method 2
the liquid cooling fluid evaporates into a gaseous cooling fluid
Implementation Method 3
the outlet section is located adjacent to the liquid outlet channel, and a cavity that is formed over the outlet section
Data Source
AI summary
An immersion cooling device for dissipating heat includes a base portion having a heat absorbing surface and a heat dissipating surface, a fin portion that arranged on the heat dissipating surface of the base portion, and a covering portion that forms a vapor chamber around the fin portion on the base portion. The covering portion can include a liquid inlet channel and a liquid outlet channel that are connected to the vapor chamber. Further, the fin portion can include a inlet section that is located adjacent to the liquid inlet channel and an outlet section that is located adjacent to the liquid outlet channel, and a cavity that is formed over the outlet section.