Dielectric liquid immersion cooling container
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Solution Overview
Problem
Existing immersion cooling containers face inefficiencies such as heat conduction and radiation through container walls, electrical charge conduction through metallic materials, difficulties in scaling production, and air entrainment, which reduces cooling efficiency and is not adaptable to unique cooling demands of different objects.
Innovation Solution
A customizable, modular immersion cooling container using layers of non-metallic, metallic, and other materials with integrated flow channels to reduce air entrainment and flow inefficiencies, allowing for adaptable cooling solutions for various heat-generating electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional metallic containers are used for immersion cooling, then structural strength is provided, but heat conduction and radiation through container walls occurs and electrical charge conduction through metallic materials happens
Solution Approach 1:
The container employs a composite structure with an inner liner made of non-conductive material (such as plastic or fiberglass) and an outer shell made of metallic material. This composite design provides the necessary structural strength from the metallic outer shell while the non-conductive inner liner prevents heat conduction and electrical charge conduction through the container walls, thus resolving the contradiction between strength and energy loss prevention.
2Strength
If traditional metallic containers are used for immersion cooling, then structural strength is provided, but electrical charge conduction through metallic materials occurs
Solution Approach 1:
The container uses a composite structure where the inner liner is made of electrically non-conductive material (such as plastic or fiberglass) and the outer shell is made of metallic material for structural strength. The non-conductive inner liner acts as an electrical barrier, preventing electrical charge conduction from the dielectric liquid to the metallic outer shell, thus eliminating the harmful electrical conduction while maintaining structural integrity.
3Ease of manufacture
If standard container configurations are used, then manufacturing simplicity is maintained, but adaptability to unique cooling demands of different objects is reduced
Solution Approach 1:
The container is divided into separate modular components: an outer shell, an inner liner, and integrated flow channels. This segmentation allows each component to be manufactured independently using standard processes, maintaining manufacturing simplicity.同时, the modular design enables easy customization by changing or reconfiguring the inner liner and flow channel arrangements to adapt to different cooling demands of various electronic objects.
Solution Approach 2:
The container incorporates adjustable and reconfigurable elements, such as removable dividers, adjustable flow channel configurations, and interchangeable inner liners. These dynamic features allow the container to be adapted to different cooling requirements of various electronic objects while maintaining a standardized base structure for easy manufacturing.
4Productivity
If conventional container designs are used, then production scaling is difficult, but customization for specific objects is needed
Solution Approach 1:
The container is designed with modular segmented components (outer shell, inner liner, flow channels) that can be manufactured independently and assembled. This segmentation enables standardized mass production of individual components, improving productivity and scalability. At the same time, the modules can be reconfigured or customized for different applications, providing the needed adaptability for object-specific cooling requirements.
5Ease of manufacture
If traditional container constructions are used, then material availability is maintained, but air entrainment within the dielectric liquid occurs reducing cooling efficiency
Solution Approach 1:
The design incorporates integrated flow channels that are specifically engineered to eliminate dead zones and promote complete liquid circulation. The flow channels are designed with smooth transitions and proper positioning to prevent air bubble entrapment, extracting the air entrainment problem from the system while maintaining the use of readily available manufacturing materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular design enhances cooling efficiency by minimizing air entrainment and flow inefficiencies, allows for scalable production, and adapts to the unique cooling demands of different electronic objects, providing effective thermal management.
Implementation Method 1
The dielectric liquid is circulated through the container and around the object to remove heat from the surface of electronic components in or on the target object
Implementation Method 2
The dielectric liquid is circulated through the container and around the object to remove heat from the surface of electronic components
Data Source
AI summary
An immersion-cooling container for single-phase liquid dielectric immersion cooling. The container has a tank and a liner, which mate together to form a sealed inflow channel and one or more sealed outflow channels. The liner and the support base comprise one or more vents to permit passage of dielectric liquid to envelop and cool equipment disposed inside the container. The liner sidewalls define one or more flow channels that promote passage of the liquid coolant from the container and into the outflow channels, thereby enabling continuous circulation of the dielectric liquid.