Immersion Cooling Flow-Equalizing Layout for Uniform Server Heat Dissipation
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Solution Overview
Problem
Existing blockchain servers face challenges with inconsistent heat dissipation due to uneven flow distribution in immersion-type single-phase liquid cooling, leading to large temperature differences and high temperatures in certain areas, which affects overall system performance.
Innovation Solution
An immersed liquid cooling system with flow-equalizing plates and a controlled circulation mechanism that adjusts hole sizes and configurations to ensure consistent fluid flow across computing devices, combined with a temperature control system using a PID thermostat and multiple cooling assemblies to stabilize temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If immersion-type single-phase liquid cooling is used, then heat dissipation efficiency is improved, but flow distribution consistency deteriorates
Solution Approach 1:
The patent applies local quality by creating different flow resistance characteristics in different regions of the cooling system. Flow resistance adjusting components are placed in specific locations to create localized flow control, ensuring that each region receives appropriate flow rates based on its heat dissipation needs, thereby improving overall flow distribution consistency while maintaining high heat dissipation efficiency.
Solution Approach 2:
The patent implements parameter changes by dynamically adjusting flow resistance values in different cooling channels. By changing the flow resistance parameters locally, the system optimizes fluid distribution across different regions, resolving the contradiction between maintaining high flow rates for efficient heat dissipation and ensuring uniform flow distribution throughout the system.
2Temperature
If flow rate is increased to cool high heat dissipation devices, then heat dissipation performance is improved, but temperature difference between devices deteriorates
Solution Approach 1:
The patent applies local quality by providing different flow resistance adjustments in different cooling channels based on the specific heat dissipation requirements of each device. High heat dissipation devices receive higher flow rates through channels with lower flow resistance, while low heat dissipation devices receive lower flow rates through channels with higher flow resistance, thereby maintaining uniform temperatures across all devices while achieving effective heat dissipation.
Solution Approach 2:
The patent implements feedback mechanisms to monitor temperature differences between devices and dynamically adjust flow resistance parameters. This closed-loop control ensures that the system automatically balances flow distribution to maintain consistent temperatures across all computing devices, preventing overheating in high heat dissipation areas while avoiding over-cooling in low heat dissipation areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves uniform heat dissipation across computing devices, enhancing computing power and energy efficiency while reducing power consumption and maintaining consistent temperatures regardless of environmental changes.
Implementation Method 1
The cooling liquid is circulated through the cooling circulation device, that is, the cold cooling liquid is continuously input and the hot cooling liquid is drawn out, to dissipate heat for the plurality of computing devices
Implementation Method 2
The cooling liquid is circulated through the cooling circulation device
Implementation Method 3
the flow-equalizing plate has a first flow-equalizing hole portion corresponding to the power module and a second flow-equalizing hole portion corresponding to the computing modules
Data Source
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AI summary
Disclosed is an immersed liquid cooling heat dissipation system, which comprises a liquid cooling module, an oil path circulation device, and a plurality of computing devices to undergo heat dissipation. Each computing device comprises a frame, a control module, a power module, and computing modules. The liquid cooling module comprise a first device slot tank, a second device slot tank, a return flow slot tank, and a flow-equalizing plate. The return flow slot tank is located between the first device slot tank and the second device slot tank, wherein the flow-equalizing plate is disposed in the first device slot tank and the second device slot tank, and the computing devices are disposed on the flow-equalizing plate. The frame is internally provided with a power module accommodating region used for accommodating the power module and a computing module accommodating region used for accommodating the computing module. The frame has a plurality of liquid-through ports for immersion and heat dissipation, and a plurality of flow-equalizing holes are formed on the flow-equalizing plate. Compared to conventional air cooling, the immersed liquid cooling heat dissipation system according to the present invention has a relatively high cooling efficiency, and can greatly improve the flow consistency of the computing devices at different parts in the liquid cooling module.