Single-Phase Immersion Cooling with Propelled Dielectric Fluid Circulation
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Solution Overview
Problem
Existing liquid-cooling systems for electronic devices face challenges such as increased costs, installation time, leakage risks, and area requirements due to changing operating temperatures, particularly when in contact with electronic systems.
Innovation Solution
A single-phase immersion cooling system using a fluid-tight containment vessel with a dielectric thermally conductive fluid and a heat exchanger system, supplemented by a propulsion-like apparatus, circulates fluid to efficiently cool electronic devices, reducing the need for additional cooling components and minimizing leakage risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a liquid-cooling system with heat exchanger and pump is used, then cooling efficiency is improved, but costs and installation time increase
Solution Approach 1:
The patent combines the cooling fluid reservoir, heat exchanger, and pump into an integrated liquid cooling unit. This merging of previously separate components into a single pre-assembled unit reduces installation time while maintaining the cooling efficiency provided by the heat exchanger and pump system.
Solution Approach 2:
The liquid cooling unit is pre-assembled with the heat exchanger, pump, and reservoir configured together before installation. This preliminary assembly of components allows for quicker installation in the data center environment while ensuring proper cooling efficiency is achieved from setup.
2Temperature
If operating temperature is increased, then cooling capacity is improved, but leakage risks and area requirements increase
Solution Approach 1:
The patent employs a dielectric fluid instead of conventional water-based cooling fluids. This parameter change in fluid type allows the system to operate at higher temperatures with improved thermal conductivity while the dielectric properties prevent electrical leakage and reduce overall leakage risks associated with high-temperature operation.
3Temperature
If additional cooling components are added, then cooling performance is improved, but device complexity and area requirements increase
Solution Approach 1:
The patent merges the reservoir, heat exchanger, pump, and associated piping into a single integrated liquid cooling unit. This consolidation maintains the cooling performance of multiple components while reducing device complexity by eliminating the need for separate installation and configuration of individual cooling components.
Solution Approach 2:
The integrated liquid cooling unit serves multiple functions simultaneously: the reservoir stores cooling fluid, the heat exchanger transfers heat, the pump circulates fluid, and the unified design manages fluid distribution. This multi-functionality in a single unit achieves the cooling performance of multiple separate components while reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively cools electronic devices with reduced installation time, costs, and area requirements while preventing damage from environmental factors, enhancing thermal management without the need for additional cooling components.
Implementation Method 1
a dielectric thermally conductive fluid contained within a fluid-tight containment vessel and a heat exchanger system circulating the dielectric thermally conductive fluid thereby cooling the heat-generating electronic device
Implementation Method 2
a heat exchanger system comprising a pump, a heat exchanger, at least a first conduit, at least a second conduit, a stand, and at least a propulsion-like apparatus
Implementation Method 3
The heat exchanger system comprises a pump, a heat exchanger, at least a first conduit, at least a second conduit, a stand, and at least a propulsion-like apparatus
Data Source
AI summary
A single-phase immersion cooling system, comprising a fluid-tight containment vessel, dielectric thermally conductive fluid, at least a heat-generating electronic device, and heat exchanger system is provided. The heat exchanger system comprises a pump, heat exchanger, at least a first conduit, at least a second conduit, stand, and at least a propulsion-like apparatus. The at least a first and second conduits have first and second modifiable portions comprising first and second openings. The first and second openings are disposed near to greatest opposing ends of the dielectric thermally conductive fluid contained within the fluid-tight containment vessel generating at least a first flow channel for directing a first flow of the dielectric thermally conductive fluid. The at least a propulsion-like apparatus moves the dielectric thermally conductive fluid from one face to an opposite face in the same direction as the first flow, supplementing and enhancing circulation within the fluid-tight containment vessel.