Immersion Cooling Condenser Tubes With Hermetic Wall Bonding
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Solution Overview
Problem
Existing cooling systems for liquid immersion cooling of electronic components face challenges in maintaining the stability and efficiency of the container construction, particularly in managing the integration of heat exchanger tubes and ensuring hermetic seals under varying pressure conditions.
Innovation Solution
A cooling system design featuring heat exchanger tubes with outer fins that are integrally bonded to the container wall, allowing for a stable and hermetic seal, optimized for mechanical stability and efficient heat transfer, with optional internal structures and materials like copper and steel tubes for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat exchanger tubes are integrated into the container wall with outer fins, then heat transfer efficiency is improved, but the complexity of ensuring hermetic seal and mechanical stability increases
Solution Approach 1:
The heat exchanger tube is merged with the container wall through integral bonding, combining the heat transfer function with the structural containment function. The outer fins are integrated directly onto the tube surface, eliminating separate heat transfer components and simplifying the overall system architecture while maintaining effective heat transfer.
Solution Approach 2:
The heat exchanger tube serves multiple functions simultaneously: it acts as a heat transfer conduit, provides structural support within the container wall, and contributes to the hermetic seal through its integral bond with the container wall. This multi-functionality reduces the number of separate components needed.
2Strength
If heat exchanger tubes are integrally bonded to the container wall, then mechanical stability is improved, but the difficulty of manufacturing and assembly increases
Solution Approach 1:
The heat exchanger tube is pre-formed with outer fins and bonding surfaces before insertion into the container wall. The integral bond is designed to be created during a single assembly operation, eliminating the need for separate bonding steps and reducing manufacturing complexity.
Solution Approach 2:
The bonding interface is designed with specific geometric parameters (fin dimensions, bond area, material properties) that enable reliable integral bonding through standard manufacturing processes. By optimizing these parameters, the bonding operation becomes simpler and more reliable.
3Area of stationary object
If outer fins are added to heat exchanger tubes, then heat transfer surface area is increased, but the amount of material and device complexity increases
Solution Approach 1:
Outer fins are added only to the portions of the heat exchanger tube that are exposed to the heat transfer medium, concentrating the heat transfer enhancement where it is most needed. The fin density and dimensions are optimized locally rather than uniformly throughout the entire tube, reducing material usage.
Solution Approach 2:
The heat transfer surface area is increased by adding fins in the radial dimension rather than increasing the tube length in the axial dimension. This dimensional approach provides substantial heat transfer area with minimal additional material compared to extending the tube length.
4Adaptability or versatility
If the cooling system operates under varying pressure conditions, then operational flexibility is improved, but the reliability of hermetic seal decreases
Solution Approach 1:
The integral bond between the heat exchanger tube and container wall is designed with sufficient bonding strength and appropriate material selection to accommodate anticipated pressure variations before they occur. This pre-engineered bonding capability ensures hermetic sealing is maintained across the full range of operational pressure conditions.
Solution Approach 2:
The bonding interface may utilize composite material structures combining different materials with complementary properties - such as a metal tube with a metallurgical bond to the container wall, or the use of high-performance bonding materials that provide both hermetic sealing and pressure resistance. This composite approach enables the seal to withstand varying pressure conditions reliably.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved mechanical stability, efficient heat transfer, and reduced material usage while maintaining a hermetic seal under both positive and negative pressure conditions, enabling flexible operation and easy maintenance.
Implementation Method 1
A heat exchanger device with heat exchanger tubes is located in the gas space of the container for liquefying gaseous heat transfer fluid
Implementation Method 2
The heat exchanger tubes have outer fins on their outer sides... efficient heat transfer
Implementation Method 3
The heat exchanger tubes have outer fins on their outer sides... optimized for mechanical stability and efficient heat transfer
Implementation Method 4
The heat exchanger tubes have an integral bond with the container wall at these passage points... hermetically sealed relative to a passage of gas or liquid
Implementation Method 5
When the components are immersed into a heat transfer fluid, which generally has a relatively low boiling point, the heat generated by the electronic component can vaporize the surrounding liquid heat transfer fluid, whereby heat is dissipated from the electronic component
Implementation Method 6
the heat generated by the electronic component can vaporize the surrounding liquid heat transfer fluid, whereby heat is dissipated from the electronic component
Data Source
AI summary
A cooling system for the liquid immersion cooling of electronic components. The cooling system includes a container having a container wall and, in the interior, a reservoir for liquid heat transfer fluid in which positioning devices for electronic components are arranged. The container has a gas chamber for gaseous heat transfer fluid. In the gas chamber of the container, there is a heat exchanger device with heat exchanger tubes for liquefying gaseous heat transfer fluid, the heat exchanger tubes having outer fins on their outer sides. The heat exchanger tubes pass into the container wall or through the container wall at passage points. The heat exchanger tubes have an integral bond with the container wall at these passage points.
