Immersion Cooling Module with Injection Plates for Hot Spot Management
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Solution Overview
Problem
High-power density electronic chips in data centers face thermal management challenges due to hot spots, which existing cooling solutions inadequately address, especially in immersion cooling systems that lack local cooling acceleration for heterogeneous components.
Innovation Solution
A cooling system utilizing a cooling module with distributed coolant fluid through injection plates directly to hot spots on high-power density chips, where the coolant fluid is accelerated by pumps and injection plates to effectively manage thermal hot spots within an immersion environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If immersion cooling is used for high-power density chips, then heat removal capacity is improved, but localized cooling acceleration for hot spots is insufficient
Solution Approach 1:
The patent implements local quality by introducing injection plates with targeted coolant injection ports positioned at specific hot spot locations on the chip. This creates localized high-velocity coolant jets that provide accelerated cooling precisely where thermal hot spots occur, while the rest of the system maintains standard immersion cooling operation. The local enhancement addresses the specific problem of insufficient hot spot cooling without requiring complete system redesign.
Solution Approach 2:
The cooling system is segmented into multiple functional zones: standard immersion cooling regions and localized injection cooling zones. The injection plates are divided into multiple sections with independent injection ports that can be individually activated based on hot spot locations. This segmentation allows the system to apply cooling acceleration only where needed, reducing overall system complexity while effectively managing hot spots.
2Productivity
If coolant fluid is directed directly to hot spots, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The injection plates are merged with the existing immersion cooling system architecture. The injection ports are integrated into the chip packaging structure, and the coolant injection function is combined with the standard immersion cooling fluid circulation. This merging allows the system to achieve enhanced cooling efficiency through direct hot spot targeting while avoiding the complexity of completely separate cooling subsystems.
Solution Approach 2:
The injection plates serve as intermediary components between the coolant fluid supply and the chip hot spots. These plates contain precisely positioned injection ports that mediate the coolant flow, directing high-velocity jets to specific hot spot locations. This intermediary structure enables efficient heat removal from hot spots without requiring complex direct coupling between the coolant source and chip surface.
3Power
If high-power density chips are packaged closer together, then computing power is improved, but thermal management difficulty increases
Solution Approach 1:
The patent applies local quality by positioning injection ports at specific locations on the injection plates that correspond to hot spot regions on densely packaged chips. The high-velocity coolant jets are directed precisely at these localized hot spots, enabling effective thermal management of high-power density chip configurations. This localized approach allows closer chip packaging while maintaining thermal control.
Solution Approach 2:
The cooling system is designed with pre-positioned injection ports on the injection plates that are configured before chip installation. The injection plate geometry and port locations are predetermined to address expected hot spot patterns in high-density chip arrangements. This preliminary configuration enables effective thermal management of high-power density packaging without requiring adaptive adjustments after deployment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides localized and efficient heat removal from hot spots on high-power density chips, enhancing the thermal management of data center components by directing coolant fluid directly to areas of high thermal demand, thereby improving the performance and reliability of electronic devices.
Implementation Method 1
coolant fluid is accelerated by the first and second injection plates to the dedicated areas of the electronic chips... provides localized and efficient heat removal from hot spots on high-power density chips
Implementation Method 2
coolant fluid merges with an immersion fluid... coolant fluid is recirculated through cooling units... heat generated by the IT equipment is captured by the cooling air and is extracted by the cooling unit
Data Source
AI summary
A cooling module includes a first cooling plate having a first internal channel and a second cooling plate having a second internal channel. The cooling module includes an interconnect frame coupled in between the first and second cooling plates, the interconnect frame includes a third internal channel that connects the first internal channel to the second internal channel. The cooling module includes a first injection plate attached to a bottom portion of the first cooling plate and a second injection plate attached to a bottom portion of the second cooling plate, the first and second injection plates manage a distribution of coolant fluid to dedicated areas of electronic chips adjacent to the first and second injection plates. The cooling module includes a first pump frame coupled to an inlet port at the first cooling plate, a first pump disposed at the first pump frame to directly intake a coolant fluid.