Immersion Cooling Apparatus with Coolant Jet Impingement
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Solution Overview
Problem
The increasing power dissipation of integrated circuit chips poses a cooling challenge, as traditional air-cooling methods become inadequate for high-power modules and large server installations, leading to stress on room air-conditioning systems.
Innovation Solution
A pumped immersion-cooling apparatus that uses a container with coolant inlet and outlet ports and a manifold structure with a coolant jet plenum and jet orifices to facilitate coolant jet impingement and wash flow for effective cooling of multiple electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling methods are used to cool high power modules, then cooling capability is improved, but energy consumption increases and acoustic noise increases
Solution Approach 1:
The patent replaces air cooling with liquid cooling by immersing electronic components in a dielectric coolant. The coolant absorbs heat directly from the components through conduction and convection, eliminating the need for high-power air-moving devices like fans and blowers. This hydraulic cooling approach significantly reduces energy consumption while maintaining effective cooling capability.
Solution Approach 2:
The patent substitutes mechanical air-moving systems (fans, blowers) with a liquid-based thermal management system. The dielectric coolant circulates through the system, absorbing and transporting heat without requiring high-speed mechanical airflow generation, thereby reducing both energy consumption and acoustic noise from mechanical components.
2Temperature
If air flow rates are increased to cool high power modules, then cooling effectiveness is improved, but the heat load on room air-conditioning systems increases
Solution Approach 1:
The patent employs liquid dielectric coolant to absorb heat directly from electronic components through immersion. The coolant circulates through heat exchangers that transfer heat to a separate cooling loop, effectively removing heat loads at the source before they can stress room air-conditioning systems. This hydraulic heat transfer approach is more efficient than air-based thermal management.
3Temperature
If liquid cooling is implemented for selected components, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The patent uses a dielectric coolant that serves multiple functions simultaneously: it provides thermal management by absorbing heat from components, acts as an electrical insulator allowing direct contact with live electronics, and functions as a working fluid in the heat transfer loop. This multi-functionality reduces overall system complexity compared to separate cooling and insulation systems.
Solution Approach 2:
The patent combines the cooling function with the electrical insulation function into a single dielectric coolant system. Rather than having separate air cooling pathways and electrical isolation measures, the dielectric liquid integrates both requirements, simplifying the overall system architecture while maintaining high heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides efficient heat transfer and reduced energy consumption by eliminating the need for air-moving devices, allowing for higher performance and reduced acoustic noise in data centers.
Implementation Method 1
The liquid coolant absorbs the heat dissipated by selected components/modules in an efficient manner
Implementation Method 2
coolant flows therethrough, the multiple different types of electronic components of the electronic system are immersion-cooled by the coolant
Implementation Method 3
at least one jet orifice in fluid communication with the coolant jet plenum. The at least one jet orifice is positioned to facilitate cooling of at least one electronic component of the multiple different types of electronic components by jet impingement of coolant thereon
Data Source
AI summary
Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic system having multiple different types of electronic components. The apparatus includes a container sized to receive the electronic system, a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container, and a manifold structure associated with the container. The manifold structure includes a coolant jet plenum with an inlet opening in fluid communication with the coolant inlet port, and one or more jet orifices in fluid communication with the coolant jet plenum. The jet orifices are positioned to facilitate cooling of at least one electronic component of the multiple different types of electronic components by jet impingement of coolant thereon when the electronic system is operatively positioned within the container for immersion-cooling thereof.