Immersion Cooling Mobile Enclosure for Vapor Containment
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Solution Overview
Problem
Existing cooling methods for semiconductor data centers, such as passive cooling, air cooling, water cooling, and immersion cooling, are not entirely sufficient due to inefficiencies and safety concerns related to coolant vapor escape during server maintenance.
Innovation Solution
A mobile enclosure is placed over the immersion cooling tank to contain coolant vapor when the tank lid is open, allowing for safe server removal and installation while preventing vapor escape into the environment. The enclosure can be integrated with an automated materials handling system and includes features like a pump for negative pressure and a recycling system for coolant vapor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the tank lid is opened for server maintenance, then server removal and installation can be performed, but coolant vapor escapes into the environment causing safety and environmental issues
Solution Approach 1:
A mobile enclosure serves as an intermediary between the open tank and the environment. The enclosure is positioned over the tank opening to contain coolant vapor while allowing maintenance personnel to access servers. The enclosure includes a transparent panel for visibility and a pump system to maintain negative pressure, preventing vapor escape while enabling safe server maintenance operations.
Solution Approach 2:
The mobile enclosure creates a controlled environment over the tank opening where coolant vapor is contained and managed. By maintaining negative pressure within the enclosure using a pump system, the vapor is prevented from escaping into the surrounding environment, effectively creating a contained atmosphere that protects against vapor release during server maintenance.
2Temperature
If immersion cooling is used to cool servers, then cooling efficiency is improved, but coolant vapor can escape during maintenance operations
Solution Approach 1:
The mobile enclosure acts as a mediator that allows the immersion cooling system to maintain its efficient cooling operation while preventing vapor escape during maintenance. The enclosure is designed to be positioned over the tank opening without interfering with the cooling process, containing vapor while permitting controlled access for server maintenance.
Solution Approach 2:
The enclosure creates a controlled environment that maintains the immersion cooling system's effectiveness while preventing harmful vapor release. The negative pressure system within the enclosure ensures that coolant vapor remains contained during maintenance operations, preserving both cooling efficiency and environmental safety.
3Object-generated harmful factors
If a mobile enclosure is added to contain vapor, then safety and environmental cleanliness are improved, but system complexity increases
Solution Approach 1:
The mobile enclosure is designed to be movable rather than fixed, allowing it to be positioned over the tank opening only when needed for maintenance operations. This dynamic design reduces permanent structural complexity while maintaining vapor containment capability during critical operations. The enclosure can be moved into position, deployed, and then removed when not needed.
Solution Approach 2:
The vapor containment function is segmented into a separate mobile enclosure unit rather than being integrated into the main tank structure. This segmentation allows the containment system to be independently deployed and removed, reducing overall system complexity while maintaining the necessary vapor containment function during maintenance operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively contains coolant vapor during server maintenance, enhancing safety and environmental cleanliness, while also allowing for efficient reuse of coolant vapor through recycling, thus improving the overall cooling efficiency and reducing costs.
Implementation Method 1
cooling a device in and by a first container of an immersion cooler
Implementation Method 2
a pump for negative pressure
Implementation Method 3
a recycling system for coolant vapor
Data Source
AI summary
A method includes: forming a cooled device by cooling a device in and by a first container of an immersion cooler; performing semiconductor processing by a processing tool in data communication with the cooled device; determining whether the cooled device is in a condition to be removed from the immersion cooler; in response to the cooled device not being in the condition, cooling the device by the immersion cooler; and in response to the cooled device being in the condition, removing the device from the first container, including: positioning a second container over the first container; and with the second container in place covering the first container: opening a lid of the first container; and removing the device from the first container.