Single-phase immersion cooling system with modifiable flow channels
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Solution Overview
Problem
Conventional liquid-cooling systems for electronic devices face challenges with increased costs, installation time, leakage risks, and area requirements, especially as operating temperatures fluctuate, due to complex setups and susceptibility to environmental factors.
Innovation Solution
A single-phase immersion cooling system utilizing a fluid-tight containment vessel with a dielectric thermally conductive fluid and a heat exchanger system, featuring modifiable conduits with openings to create adjustable flow channels, reduces the need for additional cooling components and minimizes leakage risks by circulating the fluid efficiently within the vessel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional liquid-cooling systems are used with heat exchangers in thermal contact with electronic devices, then heat can be transported away from the devices, but leakage risks increase due to multiple connection points and susceptibility to environmental factors
Solution Approach 1:
The patent merges the cooling fluid environment with the electronic device housing by submerging components in a sealed container filled with dielectric fluid. This eliminates multiple external connection points and reduces leakage risks by consolidating the cooling system into an integrated, sealed unit rather than having separate heat exchangers connected to various components.
Solution Approach 2:
The dielectric fluid acts as an intermediary that serves multiple functions: it provides thermal coupling between components, electrical insulation to prevent short circuits, and corrosion protection. This single intermediary substance replaces the need for complex multi-component cooling systems with separate heat exchangers and connection points.
2Temperature
If multiple cooling components such as heat sinks, heat sink fins, and fans are used, then electronic devices can be cooled effectively, but costs and installation time increase
Solution Approach 1:
The patent combines multiple cooling functions into a single immersion cooling system. Instead of installing separate heat sinks, fans, and coolant loops, all cooling is achieved through the dielectric fluid circulation system, dramatically reducing installation time and component count while maintaining effective heat removal from electronic devices.
Solution Approach 2:
The dielectric fluid circulation system performs multiple cooling functions universally across all submerged electronic components. A single fluid loop cools multiple devices simultaneously, eliminating the need for individual cooling assemblies for each component and reducing overall installation complexity and time.
3Reliability
If conventional liquid-cooling systems with multiple conduits and mounting portions are used, then heat exchanger functionality is achieved, but leakage risks increase along connection points
Solution Approach 1:
The patent segments the cooling system into two distinct zones: a sealed containment vessel housing the dielectric fluid and electronic components, and an external coolant circulation system. This segmentation isolates potential leakage points to the external circulation system while protecting the internal electronic environment, reducing overall leakage risks.
Solution Approach 2:
The sealed containment vessel acts as an intermediary barrier between the dielectric fluid and the external environment. This intermediate sealing layer prevents direct exposure of electronic components to potential leaks from external conduits and mounting portions, significantly reducing leakage risks while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively cools heat-generating electronic devices with reduced requirements for cooling components, decreases installation time, and minimizes risks of leakage and environmental damage, while allowing for adaptable heat transfer as operating temperatures change.
Implementation Method 1
a dielectric thermally conductive fluid contained within a fluid-tight containment vessel and at least a heat-generating electronic device submerged within the dielectric thermally conductive fluid
Implementation Method 2
The heat exchanger system circulates the dielectric thermally conductive fluid within the fluid-tight containment vessel
Implementation Method 3
a heat exchanger system comprising a heat exchanger
Data Source
AI summary
A single-phase immersion cooling system, comprising a fluid-tight containment vessel, dielectric thermally conductive fluid, at least a heat-generating electronic device, and heat exchanger system is provided. The heat exchanger system comprises a pump, heat exchanger, at least a first conduit, and at least a second conduit. The at least a first and second conduits have first and second modifiable portions comprising first and second openings submerged within the dielectric thermally conductive fluid, respectively. The at least one of the first conduit or second conduit circulates dielectric thermally conductive fluid from a heat exchanger outlet into the fluid-tight containment vessel and the other, circulates dielectric thermally conductive fluid from the fluid-tight containment vessel to a heat exchanger inlet via the pump. The first and second openings are disposed near to greatest opposing ends of the dielectric thermally conductive fluid contained within the fluid-tight containment vessel.