Immersion Cooling Nozzle Array for Electronic Component Heat Extraction
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Solution Overview
Problem
Existing immersion cooling devices face challenges in achieving sufficient cooling performance due to limitations in increasing flow speed over electronic components, leading to inadequate heat extraction.
Innovation Solution
The immersion cooling device employs a container with a substrate immersed in cooling liquid and nozzles that eject cooling liquid in parallel flows from one end to the other, with a flow rate regulating unit to control the cooling liquid distribution, ensuring effective cooling of electronic components based on their heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the flow path width of the cooling liquid is narrowed at the position corresponding to the electronic component, then the average flow speed in the region is increased, but the flow speed cannot be increased to a desired degree depending on the position of the electronic component
Solution Approach 1:
The cooling system is divided into multiple independent nozzle units, each capable of directing cooling liquid to specific regions. This segmentation allows different flow rates to be applied to different electronic components based on their individual cooling requirements, resolving the contradiction between achieving high flow speed and maintaining effective cooling across various positions.
Solution Approach 2:
Each nozzle is equipped with an independent flow rate regulating unit that allows the cooling liquid flow rate to be adjusted according to the specific cooling needs of each electronic component. This local quality control enables high flow speed to be achieved at positions requiring intensive cooling while maintaining appropriate flow rates at other positions, thereby resolving the contradiction between flow speed and cooling effectiveness.
2Temperature
If multiple nozzles are provided to increase cooling coverage, then more electronic components can be cooled, but the device complexity increases
Solution Approach 1:
Multiple nozzles are designed with identical or similar structures, each comprising a nozzle body and a flow rate regulating unit. This universality allows the system to achieve broad cooling coverage while minimizing device complexity, as each nozzle unit can be manufactured and controlled in a standardized manner, reducing the overall system complexity despite the increased number of components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for selective and efficient cooling of electronic components by adjusting the flow rate and distribution of cooling liquid, enhancing heat transfer and addressing the limitations of previous cooling methods.
Implementation Method 1
a nozzle that ejects the cooling liquid such that the cooling liquid flows from one end toward the other end of the substrate, over a surface on which the electronic components are provided
Implementation Method 2
cooling liquid flows from one end toward the other end of the substrate, over a surface on which the electronic components are provided
Data Source
AI summary
An immersion cooling device includes a container which stores therein a cooling liquid, a substrate which is disposed so as to be immersed in the cooling liquid in the container and to which a plurality of electronic components are mounted, and nozzles which eject the cooling liquid such that the cooling liquid flows from one end of the substrate to the other end of the substrate, over the surface on which the electronic components are provided. A plurality of nozzles are provided so that a plurality of cooling liquid currents flowing from the one end to the other end of the substrate are formed in parallel.