Immersion Cooling Power Distribution with Condenser Leak Protection
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Solution Overview
Problem
Conventional fan-based cooling systems for large-scale server systems are inefficient and costly, especially as server densities increase, due to high power consumption and thermal management challenges, and they require careful air-quality control.
Innovation Solution
A multi-phase heat transfer immersion cooling system that submerges servers in a dielectric liquid, using a two-phase vaporization-condensation cycle to cool electronic components, with a condenser above the liquid surface to prevent electrical arching and optimize power distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fan-based cooling systems are used for server systems, then cooling capability is provided, but power consumption increases exponentially with server density
Solution Approach 1:
The patent replaces the mechanical fan-based cooling system with a liquid immersion cooling system. Servers are submerged in dielectric liquid that directly contacts heat-generating components, eliminating the need for mechanical fans and their associated power consumption. The liquid cooling system provides superior heat transfer efficiency without the exponential power increase seen in fan-based systems.
Solution Approach 2:
The patent employs hydraulic cooling by circulating dielectric liquid through and around server components. The liquid absorbs heat from servers and transports it to external heat exchangers, providing efficient thermal management through fluid-based heat transfer rather than air-based convection requiring mechanical force.
2Temperature
If air cooling is used for electronic components, then cooling is achieved, but air-quality control (temperature, humidity, altitude, particulate) is required
Solution Approach 1:
The patent uses dielectric liquid as an inert cooling medium that eliminates the need for controlled air environments. The liquid provides cooling without requiring management of temperature, humidity, altitude, or particulate conditions associated with air-based cooling systems. The sealed liquid environment naturally protects against contamination while providing thermal management.
3Reliability
If power distribution units are placed above dielectric liquid surface, then electrical safety is maintained, but condensation liquid leakage causes electrical arching
Solution Approach 1:
The patent introduces a physical barrier (tank wall or partition) as an intermediary between the condensation liquid collection area and the power distribution units. This barrier prevents direct contact between leaked condensation liquid and electrical components, eliminating the electrical arching hazard while allowing PDUs to be positioned for optimal power distribution. The intermediary structure isolates the harmful factor from the sensitive component.
Solution Approach 2:
The patent extracts the power distribution units from the area above the dielectric liquid surface and relocates them to a separate compartment or elevates them above potential condensation liquid levels. This separation removes PDUs from the zone where condensation liquid leakage could occur, eliminating the electrical safety hazard while maintaining power distribution functionality through extended conduits or wireless power transfer.
4Productivity
If server density is increased in rack-based systems, then processing power and storage capacity increase, but thermal management challenges worsen
Solution Approach 1:
The patent merges the cooling function directly with the server housing by integrating heat exchanger surfaces into server chassis walls and components. This allows dielectric liquid to flow directly through server housings, absorbing heat at the source and enabling high server density without thermal management challenges. The merging of cooling channels with structural elements provides efficient heat removal for dense configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces power usage, enhances cooling efficiency, and eliminates the need for large heat sinks, allowing for higher server densities and flexible data center design without the need for air-conditioned spaces.
Implementation Method 1
submerging and operating the physical information handling systems in a volatile (i.e., low boiling point) liquid within the multi-phase heat transfer immersion cooling tank
Implementation Method 2
a condenser located above the surface of the dielectric liquid and including a condensation surface and a condensation liquid flowing through the condensation surface
Implementation Method 3
multi-phase heat transfer immersion cooling tank that enables direct cooling of information handling systems by submerging and operating the physical information handling systems in a volatile (i.e., low boiling point) liquid
Data Source
AI summary
An immersion cooling tank comprises: a dielectric liquid disposed within a lower volume of the tank; at least one electronic equipment immersed within the dielectric liquid and which requires electrical power to operate; and at least one power distribution unit and/or a bus bar distribution system submerged beneath a surface of the dielectric liquid and providing electrical power to the at least one electronic equipment. The immersion cooling tank further includes a condenser located vertically above the dielectric fluid and the at least one electronic equipment, and through which is flowing a condensation fluid that has a lower density than the dielectric liquid. A leak of the condensation fluid into the tank volume results in the condensation fluid floating atop the dielectric liquid and prevents the condensation liquid from coming into contact with the power distribution unit. The bus bar distribution system enables blind mating of inserted electronic components.