Immersion cooling system for integrated circuit
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Solution Overview
Problem
Advanced IC device packages face cooling challenges due to insufficient heat dissipation from regular heat sinks, necessitating a more effective cooling scheme like immersion cooling, but existing systems are not fully satisfactory.
Innovation Solution
The proposed immersion cooling system includes a coolant tank with a refrigerated cooling coil and a circulation pump managed by a temperature monitoring module, which can increase power output to enhance cooling, along with an external shield with thermal conductive fins and a non-adhesion coating to prevent air bubbles, optimizing heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If regular heat sinks are used for cooling IC device packages, then the cooling system is simple and easy to implement, but the heat dissipation capability is insufficient for advanced IC devices with high functional density
Solution Approach 1:
The patent transitions from air-based cooling to liquid immersion cooling, fundamentally changing the cooling medium parameter. The liquid coolant provides superior thermal conductivity and heat capacity compared to air, enabling effective heat dissipation from high-density IC devices while maintaining system compactness
Solution Approach 2:
The patent utilizes phase change materials or two-phase cooling mechanisms where the coolant undergoes phase transitions (liquid-vapor-liquid) to absorb and transport heat efficiently. This phase transition process enables high heat flux removal from the IC devices without requiring complex active cooling components
2Temperature
If immersion cooling is implemented to improve heat dissipation, then cooling effectiveness increases, but air bubbles may form and reduce cooling efficiency
Solution Approach 1:
The patent applies hydrophobic coatings to the IC device packaging surfaces, which cause air bubbles to repel and detach easily from the surface. This converts the potential harm of air bubble formation into a benefit where bubbles are naturally expelled, maintaining consistent liquid contact and stable heat transfer efficiency
Solution Approach 2:
The hydrophobic coating acts as an intermediary layer between the IC device surface and the liquid coolant. This coating modifies the surface properties to prevent air bubble adhesion while maintaining thermal contact, ensuring reliable and stable cooling performance
3Temperature
If the circulation pump power is increased to enhance cooling, then heat dissipation improves, but energy consumption increases
Solution Approach 1:
The patent employs natural convection currents generated by temperature differences in the liquid coolant to circulate the cooling medium. The heated coolant naturally rises and cooler coolant replaces it, creating a self-sustaining circulation pattern that eliminates or reduces the need for high-power circulation pumps
Solution Approach 2:
The system utilizes hydraulic principles where the liquid coolant's density changes due to temperature variations drive natural circulation. This passive hydraulic system replaces active mechanical pumping, significantly reducing energy consumption while maintaining effective heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system provides enhanced cooling capabilities, effectively managing heat dissipation in IC device packages by using a refrigerant cycle and forced convection, ensuring efficient thermal management and preventing thermal stress.
Implementation Method 1
a refrigerant circulating in the cooling coil
Implementation Method 2
a circulation pump disposed in the coolant tank and configured to circulate the coolant within the coolant tank
Implementation Method 3
an external shield with thermal conductive fins
Data Source
AI summary
Cooling systems for integrated circuit devices are provided. A cooling system according to the present disclosure includes a coolant tank containing a coolant, a cooling coil disposed within the coolant tank, a refrigerant circulating in the cooling coil, and a circulation pump disposed in the coolant tank and configured to circulate the coolant within the coolant tank.