Two-Phase Immersion Cooling With Self-Regulating Vapor Circulation
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Solution Overview
Problem
The increase in heat generation by high-performance electronic components like CPUs, GPUs, and server systems leads to overheating issues, reducing their reliability and performance, and existing two-phase immersion cooling systems face challenges in managing vapor bubble formation and fluid circulation efficiently, leading to increased complexity and costs.
Innovation Solution
A two-phase immersion cooling apparatus with a coolant tank, condenser, and heat transfer enhancer that includes a directed flow opening, containment walls, and redirection flow orifices to enhance vapor bubble nucleation, growth, and circulation, maximizing heat absorption and condensation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If two-phase immersion cooling systems are used to dissipate heat from high-performance electronic components, then heat transfer efficiency is improved, but system complexity and cost increase due to challenges in managing vapor bubble formation and fluid circulation
Solution Approach 1:
The heat transfer enhancer enables the system to self-regulate vapor bubble formation and fluid circulation without external controls. The structured surface promotes natural nucleation and the redirected vapor bubbles naturally circulate back to the liquid region, eliminating the need for complex monitoring and regulation systems while maintaining high heat transfer efficiency
Solution Approach 2:
The heat transfer enhancer introduces localized structured surfaces with specific nucleation sites in the liquid region where vapor bubbles form. This local modification creates controlled vapor generation zones that improve overall heat transfer without requiring system-wide complexity
2Loss of energy
If vapor bubbles are allowed to form and rise in the immersion tank, then heat is carried away from electronic components, but fluid evaporation increases when lids are not used
Solution Approach 1:
The system converts the potentially harmful effect of vapor escape (evaporation loss) into a beneficial circulation mechanism. Vapor bubbles that would normally escape are redirected by the heat transfer enhancer back into the liquid region, where they condense and release heat, transforming evaporation loss into useful heat transfer while minimizing fluid loss
3Productivity
If pressure in the immersion tank is increased to improve fluid flow and vapor bubble formation rate, then heat transfer is enhanced, but additional controls are needed to monitor and regulate temperature and pressure
Solution Approach 1:
The heat transfer enhancer creates a self-regulating system where vapor bubble formation rate is controlled by the structured surface properties and local pressure conditions rather than system-wide pressure control. The natural circulation pattern self-regulates the bubble formation and return cycle without requiring external monitoring or regulation equipment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively dissipates heat by accelerating fluid circulation and maximizing vapor bubble nucleation and condensation, maintaining high heat transfer efficiency while minimizing evaporation, thus enhancing the reliability and performance of electronic components.
Implementation Method 1
Heat is absorbed by fluid surrounding the submerged electronic components, forming vapor bubbles
Implementation Method 2
a working fluid of a fluid bath is passively circulated in an immersion tank with electronic components by liquid-to-gas phase transition for cooling
Implementation Method 3
The bubbles boil off or vaporize into a gas, thereby carrying heat away from the electronic components
Implementation Method 4
The vapor rises above the fluid bath where they contact a heat exchanger (at least one condenser) that is cooler than the vaporized gas. The vapor condenses back into a liquid and drip back into the fluid bath to be recycled
Implementation Method 5
The vapor rises above the fluid bath where they contact a heat exchanger (at least one condenser) that is cooler than the vaporized gas
Implementation Method 6
an accelerated flow region is formed between the directed flow opening of the heat transfer enhancer and the bottom surface of the coolant tank
Implementation Method 7
the heat transfer enhancer including: a directed flow opening; an upper surface opposite the directed flow opening; a plurality of containment walls extending downwardly from a surface perimeter of the upper surface; and at least one redirection flow orifice positioned on either the containment wall or the upper surface
Data Source
AI summary
A two-phase immersion cooling device includes a coolant tank defining a liquid region for retaining a working fluid and a vapor region above it. A condenser is at least partially disposed in the vapor region. A heat transfer enhancer is positioned in the liquid region and thermally coupled to a heat dissipating component. The heat transfer enhancer includes a directed flow opening, an upper surface, and containment walls. A redirection flow orifice is formed on the upper surface or the containment wall. A pressure enhanced region is adjacent to the upper surface and in communication with a boiling region below. An accelerated flow region is formed beneath the directed flow opening, and a recycling flow region is defined between a containment wall and a tank side wall.