Immersion De-taping Fluid Mediator for 3DIC Substrate Yield
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Solution Overview
Problem
The semiconductor industry faces challenges in efficiently removing tapes from substrates during the singulation process of three-dimensional integrated circuit (3DIC) structures, which can lead to electrostatic discharge (ESD) events and affect yield due to the high contact area between the tape and substrate.
Innovation Solution
An immersion de-taping process is employed, where a fluid with specific properties is used to create a capillarity effect between the tape and substrate, reducing the contact area and facilitating the removal of the tape, potentially aided by a de-taping apparatus with adjustable angles and rollers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional de-taping is used, then tape removal is achieved, but high contact area causes ESD events and reduces yield
Solution Approach 1:
A fluid intermediary is introduced between the substrate and the de-taping tool during the de-taping process. This fluid layer acts as a mediator that reduces direct contact between the tape and substrate, thereby minimizing electrostatic discharge events while facilitating tape removal. The fluid serves as a protective barrier that maintains reliability during the de-taping operation.
2Strength
If tape contact area with substrate is increased, then tape holding is improved, but ESD risk increases
Solution Approach 1:
Hydraulic principles are applied by using a fluid medium to control the interaction between the tape and substrate. The fluid creates a controlled environment that maintains adequate tape holding through fluid pressure and adhesion, while simultaneously reducing the contact area that causes ESD events. This hydraulic approach allows strength maintenance with reduced harmful contact.
3Productivity
If de-taping speed is increased, then productivity improves, but control over ESD reduction may be compromised
Solution Approach 1:
The fluid is applied to the substrate before the de-taping process begins. This preliminary action ensures that the ESD-protective fluid layer is already in place, allowing subsequent rapid de-taping operations to proceed without compromising ESD control. The preparatory fluid application enables high-speed de-taping while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process reduces the contact area between the tape and substrate, minimizing ESD events and increasing product yield by allowing for a more controlled and efficient tape removal, thereby improving the integration density and packaging efficiency of semiconductor devices.
Implementation Method 1
a fluid with specific properties is used to create a capillarity effect between the tape and substrate, reducing the contact area and facilitating the removal of the tape
Data Source
AI summary
Embodiments using immersion de-taping are described. A substrate having a substrate tape attached thereto is provided. The substrate includes electrically conductive connectors attached to the substrate tape. A fluid is provided between the substrate and the substrate tape. While the fluid is between the substrate and the substrate tape, the substrate tape is removed from the substrate. Another embodiment is an apparatus comprising an immersion tank, a substrate chuck, first and second fixed rollers, and a moveable roller. The substrate chuck is configured to secure a substrate and to place the substrate into the immersion tank. The first fixed roller is operable to dispense a clamp tape. The second fixed roller is operable to roll the clamp tape. The moveable roller is operable to extend into the immersion tank and to adhere the clamp tape to a substrate tape on the substrate.