Immersion Lithography Substrate Support Thermal Decoupler
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Solution Overview
Problem
In immersion lithography, substrate temperature control is challenging due to heat loads induced by vaporization of immersion liquid, leading to temperature gradients and imaging quality issues.
Innovation Solution
A substrate support system with a central part and peripheral part, featuring a thermal decoupler to minimize heat transfer between the central and peripheral parts, and a fluid temperature control system that predicts and adjusts heat loads by supplying fluid through ducts with predetermined temperature offsets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the immersion liquid is removed via the peripheral part of the substrate support, then the liquid removal function is improved, but heat transport between the central and peripheral parts increases causing temperature gradients
Solution Approach 1:
The substrate support is divided into a central part and a peripheral part that are thermally decoupled. The thermal decoupler separates the heat transport paths, allowing the peripheral part to perform liquid removal functions while the central part maintains stable temperature for substrate processing.
Solution Approach 2:
A thermal decoupler is introduced as an intermediary element between the central and peripheral parts of the substrate support. This decoupler controls and reduces heat transport between the two regions, preventing temperature gradients while allowing the peripheral part to function for liquid removal.
2Temperature
If thermal stabilization is improved in the central part, then substrate temperature control is improved, but heat transport to the peripheral part increases causing vaporization issues
Solution Approach 1:
The substrate support structure is segmented into thermally independent zones using a thermal decoupler. This segmentation allows the central part to be thermally stabilized for substrate processing while the peripheral part can manage heat dissipation separately, preventing unwanted vaporization.
Solution Approach 2:
The thermal decoupler acts as a thermal mediator that regulates heat flow between the central and peripheral parts. It allows sufficient heat transport to maintain peripheral temperature for liquid removal while preventing excessive heat that would cause vaporization and contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved thermal stabilization of the substrate, reducing thermal distortions and enhancing imaging quality by maintaining distinct temperature gradients between the central and peripheral parts, thus addressing the heat load challenges in immersion lithography.
Implementation Method 1
a thermal decoupler arranged to decrease heat transport between the central part and the peripheral part
Implementation Method 2
supplying a fluid to the substrate support; ducting the fluid through a duct of the substrate support; estimating a temperature change to the fluid between supplying the fluid to the substrate support and the fluid being ducted along a control position in the duct
Data Source
AI summary
A substrate support constructed to support a substrate for immersion lithographic processing is disclosed. The substrate support has a central part and a peripheral part positioned around the central part. The substrate support further includes a thermal decoupler arranged to decrease heat transport between the central part and the peripheral part.