Chemical Shielding Structure for Immersion-Cooled Memory PCBs
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Solution Overview
Problem
Existing immersion cooling systems for high-performance computing equipment face challenges with corrosion and degradation of integrated circuit packaging materials due to interactions with chemical additives or impurities in the coolant.
Innovation Solution
The use of a deformable, high thermal conductivity protective film or a graphene-reinforced polymer enclosure to isolate printed circuit boards and their surface-mounted devices from the liquid coolant, while maintaining effective thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If components are directly exposed to liquid coolant for immersion cooling, then cooling efficiency is improved, but corrosion and degradation of packaging materials occur
Solution Approach 1:
A protective film or coating is introduced as an intermediary layer between the electronic components and the coolant. This film allows thermal energy to pass through while blocking chemical interactions, thus maintaining cooling efficiency while preventing corrosion and degradation of packaging materials.
Solution Approach 2:
The protective film is constructed using composite materials that combine high thermal conductivity with chemical resistance. This enables the film to simultaneously conduct heat effectively from the components while resisting degradation from exposure to coolant chemicals and impurities.
2Reliability
If a protective film is introduced to prevent corrosion, then reliability is improved, but thermal conduction may be compromised
Solution Approach 1:
The protective film utilizes composite materials with high thermal conductivity combined with corrosion-resistant properties. This ensures that the film maintains effective heat transfer from the components while providing the necessary chemical barrier against the coolant.
Solution Approach 2:
The film's physical and chemical parameters are optimized to achieve the right balance between thermal conductivity and chemical resistance. By carefully selecting and tuning these parameters, the film allows sufficient heat passage while maintaining robust protection against coolant degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively protects the circuit components from corrosion and degradation, while ensuring efficient heat transfer to the coolant, thereby extending the lifespan of the hardware and improving cooling efficiency.
Implementation Method 1
isolate printed circuit boards and their surface-mounted devices from the liquid coolant
Implementation Method 2
maintaining effective thermal dissipation
Data Source
AI summary
A memory device for use in immersion cooling comprises a printed circuit board, one or more surface-mounted devices coupled to the printed circuit board, and an electrically non-conductive and thermally-conductive container surrounding the surface-mounted devices. The container may comprise a polymer bag or a Graphene-Reinforced Polymer enclosure. The polymer bag may be a polydimethylsiloxane film bag including a ceramic filler. The container is sealed to the printed circuit board at one or more sides of the printed circuit board, for example next to an M.2 connector.