Immersion Refrigerant Cooling for High-Power Aircraft Electronics
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Solution Overview
Problem
Conventional thermal management systems for aircraft electronics are heavy and complex, as they consist of independent cooling systems that cannot efficiently manage increasing thermal losses from high-power electronics.
Innovation Solution
A refrigeration system integrating a compressor, condenser, evaporator, immersion cooling container, and expansion valves, which utilizes a vapor cycle thermal management system to cool electronics directly with a refrigerant, reducing weight and complexity by leveraging existing aircraft systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional independent cooling systems are used for aircraft electronics, then the electronics can be cooled, but the system weight and complexity increase
Solution Approach 1:
The patent combines the electronics cooling function with the existing aircraft vapor cycle air conditioning system by integrating an immersion cooling container into the refrigerant circulation path. The refrigerant from the aircraft's AC system is routed through the container to directly cool the electronics, eliminating the need for separate dedicated cooling systems and reducing overall system complexity
Solution Approach 2:
The immersion cooling container serves multiple functions: it acts as both a thermal management device for electronics and a component within the aircraft's existing vapor cycle air conditioning system. The same refrigerant circulation system provides both cabin air conditioning and electronics cooling, making the system multi-functional and reducing redundant components
2Temperature
If conventional independent cooling systems are used for aircraft electronics, then the electronics can be cooled, but the system weight increases
Solution Approach 1:
The patent merges the electronics cooling system with the aircraft's existing vapor cycle air conditioning system, sharing common components such as the compressor, condenser, and refrigerant circulation infrastructure. This integration eliminates duplicate heavy components and reduces the overall weight of the thermal management system
Solution Approach 2:
The refrigeration system performs dual functions by providing both cabin air conditioning and electronics cooling through the same refrigerant circulation loop. This multi-functionality eliminates the need for separate dedicated cooling systems, thereby reducing the total weight of stationary cooling equipment required on the aircraft
3Power
If high-power electronics are used in aircraft, then the power capability increases, but the thermal losses and cooling requirements increase
Solution Approach 1:
The patent utilizes the phase transition properties of refrigerant in the immersion cooling container, where the refrigerant absorbs heat from the electronics through evaporation and phase change. This efficient heat transfer mechanism enables the system to handle the increased thermal loads generated by high-power electronics without requiring proportionally larger cooling infrastructure
Solution Approach 2:
The system employs a vapor cycle refrigeration system using refrigerant fluid circulation to transfer heat from the electronics. The refrigerant absorbs thermal energy from the electronics through direct contact in the immersion cooling container and rejects it elsewhere in the cycle, providing an efficient method to manage thermal losses from high-power electronics
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integrated system effectively cools electronics while minimizing weight and power demand, enhancing heat transfer efficiency through two-phase immersion cooling, and increasing the power capability of electronic systems.
Implementation Method 1
a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system
Implementation Method 2
a condenser disposed downstream of the compressor on the main line
Implementation Method 3
an evaporator configured to receive heat into the refrigerant from an external heat source
Implementation Method 4
The evaporator line can include a first expansion valve and the immersion line can include a second expansion valve
Implementation Method 5
the electronics are in direct fluid communication with the refrigerant to cool the electronics
Data Source
AI summary
A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.