Immersion Resist Composition for 193 nm Lithography
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current chemical amplification resists used in semiconductor manufacturing face challenges with pattern collapse and development defects, particularly when exposed to immersion liquids, leading to rough line width roughness and increased defects in fine pattern formation.
Innovation Solution
An actinic ray-sensitive resin composition is developed, comprising a resin that increases solubility in alkali developers, a compound generating acid upon irradiation, and a resin with fluorine or silicon atoms and polarity converting groups, specifically designed for immersion exposure to reduce pattern collapse and development defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If chemical amplification resist is used for immersion exposure, then sensitivity is improved, but pattern collapse occurs and line width roughness increases
Solution Approach 1:
The patent uses a composite resin system comprising a polyhydroxystyrene backbone with pendant carboxylic acid groups and fluorinated alkyl chains. This composite structure provides both the chemical amplification capability for high sensitivity and the hydrophobic properties needed to prevent pattern collapse and reduce line width roughness during immersion exposure
Solution Approach 2:
The patent modifies the chemical composition parameters of the resist by incorporating fluorinated groups and carboxylic acid functionalities. These parameter changes alter the resin's hydrophobicity and acid-base properties, enabling the resist to maintain pattern integrity while achieving high sensitivity in immersion exposure conditions
2Reliability
If resin containing silicon or fluorine atoms is added to prevent bleed-out, then immersion liquid compatibility is improved, but pattern collapse and development defects increase
Solution Approach 1:
The patent incorporates fluorinated alkyl chains as pendant groups on the polyhydroxystyrene backbone, creating local hydrophobic regions. This local quality modification provides immersion liquid compatibility at the molecular level while maintaining overall pattern formation quality through the hydrophilic carboxylic acid groups
3Productivity
If scanning-type immersion exposure is used to increase productivity, then exposure speed is improved, but followability of immersion liquid decreases
Solution Approach 1:
The patent modifies the surface energy parameters of the resist by incorporating fluorinated groups, which reduce surface polarity. This parameter change improves the wetting characteristics and followability of the immersion liquid during scanning exposure, enabling high-speed processing without compromising liquid stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved pattern performance with reduced defects and enhanced line width roughness, ensuring better resolution and stability during the formation of fine patterns.
Implementation Method 1
decomposing an acid generator in the exposed area upon exposure to produce an acid
Implementation Method 2
the film has a transmittance of 55 to 80% for light at a wavelength of 193 nm
Data Source
AI summary
An actinic ray-sensitive or radiation-sensitive resin composition, wherein when a film having a film thickness of 100 nm is formed from the actinic ray-sensitive or radiation-sensitive resin composition, the film has a transmittance of 55 to 80% for light at a wavelength of 193 nm, and a pattern forming method using the composition are provided.