Immersion-Sealed Water Block for Chemically Compatible Liquid Cooling
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Solution Overview
Problem
Existing water block cooling solutions are insufficient for efficient heat dissipation in electronic equipment, leading to potential service loss and damage in data centers due to chemical incompatibility between immersion cooling liquids and conventional thermal pastes.
Innovation Solution
A water block design that incorporates a gasket to fluidly seal the surface with thermal paste from the immersion cooling liquid, allowing for the use of chemically incompatible liquids and avoiding the need for expensive Indium-based thermal pastes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional thermal paste is used with water block cooling, then cost is reduced and thermal conductivity is improved, but chemical compatibility with immersion cooling liquid deteriorates
Solution Approach 1:
The water block is segmented into distinct functional zones: a first surface for thermal contact with the electronic component, and a second surface for immersion cooling liquid contact. This segmentation allows different materials to be used in different zones, with the first surface using cost-effective thermal paste and the second surface using immersion cooling liquid-compatible materials.
Solution Approach 2:
A gasket acts as an intermediary barrier between the thermal paste on the first surface and the immersion cooling liquid. The gasket prevents direct contact between chemically incompatible materials, allowing the use of conventional thermal paste while maintaining chemical compatibility with the immersion cooling liquid.
2Reliability
If Indium-based thermal paste is used, then chemical compatibility with immersion cooling liquid is improved, but cost increases significantly and sustainability deteriorates
Solution Approach 1:
The water block separates the system into two distinct zones with different material requirements. The first surface zone can use inexpensive, sustainable conventional thermal paste, while the second surface zone uses materials compatible with immersion cooling liquid, eliminating the need for expensive Indium.
Solution Approach 2:
The gasket serves as a protective intermediary that shields the thermal paste from exposure to immersion cooling liquid. This allows the use of cost-effective conventional thermal paste without compromising chemical compatibility, as the gasket prevents any direct interaction between incompatible materials.
3Temperature
If water block cooling is used, then cooling efficiency is improved, but heat dissipation may still be insufficient for high TDP components
Solution Approach 1:
The patent merges two cooling approaches into a single integrated system: water block cooling for direct heat extraction from the electronic component, and immersion cooling for additional heat dissipation from the water block itself. This combination provides enhanced heat dissipation capacity for high TDP components.
Solution Approach 2:
The water block employs composite material construction with different materials optimized for different functions: highly thermally conductive materials for the first surface to maximize heat transfer from the component, and immersion cooling liquid-compatible materials for the second surface. This composite approach optimizes both cooling efficiency and heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides cost-effective and sustainable enhanced cooling for electronic components by preventing chemical breakdown and reducing the reliance on expensive Indium-based materials, while maintaining effective heat transfer.
Implementation Method 1
a gasket configured to extend away from the body beyond the first surface in a direction transverse thereto, to fluidly insulate the first surface when the first surface is mounted on the electronic component and submerged in the immersion cooling liquid in use
Implementation Method 2
a first surface configured for mounting on the electronic component and permitting thermal transfer therethrough
Implementation Method 3
A heat-transfer fluid flows through an internal conduit of the water block to collect thermal energy from the electronic component
Data Source
AI summary
A cooling device mountable on an electronic component comprising: a body having an internal fluid conduit for allowing a heat-transfer fluid to flow therethrough. The body comprises a first surface configured for mounting on the electronic component and permitting thermal transfer therethrough; a second surface; at least one side wall extending between the first surface and the second surface; and a gasket extending along the at least one side wall or a perimeter of the first surface, the gasket configured to extend away from the body beyond the first surface in a direction transverse thereto, to fluidly insulate the first surface when the first surface is mounted on the electronic component and submerged in the immersion cooling liquid in use.