Immersion Server Top-Panel Coolant Distribution for High-TDP Cooling

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing server type information handling systems face challenges in efficiently dissipating the thermal design power (TDP) of high-power components due to limited thermally conductive liquid volume, leading to increased cost and complexity with hybrid DLC/immersion cooling solutions.

Innovation Solution

A liquid cooling liquid distribution system with integrated and ducted liquid pathways is implemented, focusing coolant flow on high-power components within a hermetically sealed immersion chassis, using a chassis top panel with a liquid distribution chamber and ducted apertures to direct coolant flow effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If hybrid direct liquid cooling and immersion approaches are used to cool high power components, then cooling effectiveness is improved, but cost and system complexity increase

Engineering Contradiction:
Improvecooling effectivenessVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines direct liquid cooling and immersion cooling into a unified system where the chassis itself serves as the cooling vessel. The hermetically sealed chassis contains cooling liquid that directly contacts high power components through designated pathways, eliminating the need for separate cooling loops and reducing system complexity while maintaining cooling effectiveness.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The chassis structure serves multiple functions: it provides mechanical support for components, acts as a hermetic seal to contain the cooling liquid, and functions as the cooling system itself through integrated liquid pathways. This multi-functionality reduces the number of separate components needed and simplifies the overall system architecture.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If hermetically sealed chassis with integrated liquid pathways is used, then cooling liquid is contained effectively, but manufacturing complexity increases

Engineering Contradiction:
Improveliquid containmentVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The liquid distribution pathways are integrated directly into the chassis structure rather than being separate components. This merging of functions allows the chassis to serve as both the containment vessel and the distribution system, reducing the number of assembly steps and manufacturing complexity while ensuring reliable liquid containment through the hermetic seal.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances cooling efficiency for high thermal design power requirements by ensuring adequate coolant flow, reducing complexity and cost compared to hybrid solutions.

Implementation Method 1

the top panel top wall and the top panel bottom component being hermetically sealed along edges of the top panel bottom component to provide a liquid distribution chamber

Methodology Applied
Scientific EffectHermetic sealing:

Implementation Method 2

internal immersion cooling, an entire interior of a chassis of a server type information handling system is filled with liquid and sealed to prevent liquid escape

Methodology Applied
Scientific EffectConvection cooling: Convection

Data Source

PatentUS12563706B2Server system liquid cooling system
Publication Date: 2026.02.24 DELL PROD LP
  • US12563706B2 patent drawing
  • US12563706B2 patent drawing
  • US12563706B2 patent drawing

AI summary

A cooling liquid distribution system for an immersion cooled server type information handling system. The cooling liquid distribution system includes an information handling system chassis and a top panel portion, the top panel portion comprising a top panel top wall and a top panel bottom component, the top panel top wall being configured to be hermetically sealed to the information handling system chassis when the top panel portion is installed on the information handling system chassis, the top panel top wall and the top panel bottom component being hermetically sealed along edges of the top panel bottom component to provide a liquid distribution chamber, the top panel bottom component defining a plurality of cold liquid outlets, the plurality of cold liquid outlets being positioned to direct cooling liquid flow across a top of an interior of an information handling system chassis of the immersion cooled server type information handling system.