Dissipating Device Using Immiscible Fluid Phase Transition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-performance electronic devices, especially those that are thin and light, face overheating issues due to inefficient heat dissipation methods, as traditional heat dissipation techniques like heat pipes struggle to evenly distribute heat, leading to reduced efficiency and potential device slowdown or crash.
Innovation Solution
A dissipating device utilizing two immiscible fluid mediums as a thermal conductive fluid that undergoes phase transition, creating a continuous circulation and flow to effectively cool electronic devices by forming an accommodating space between two sheet bodies and using the difference in specific gravity and density to facilitate heat absorption and convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat pipes are installed in thin and light electronic devices, then heat dissipation capability is improved, but device thickness increases and heat distribution remains uneven
Solution Approach 1:
The patent employs phase change material (paraffin) that transitions between solid and liquid states to absorb and dissipate heat. The phase transition occurs within the confined space of the thin dissipating device, allowing effective heat dissipation without increasing device thickness. The paraffin absorbs heat during melting and releases it during solidification, creating a thermal regulation effect.
Solution Approach 2:
The dissipating device uses a composite structure combining metal sheet bodies (aluminum or copper) with phase change material (paraffin) and heat dissipation gel. This composite material approach allows the device to maintain thin dimensions while achieving superior heat dissipation performance through the synergistic effects of high thermal conductivity materials and phase change heat absorption.
2Temperature
If heat pipes are used for heat dissipation, then heat removal is improved, but heat distribution becomes uneven leading to local overheating
Solution Approach 1:
The phase change material uniformly distributes heat throughout the dissipating device as it melts and solidifies. During phase transition, the material absorbs heat evenly across its volume, preventing localized hot spots. The continuous phase change process ensures uniform heat distribution across the chip surface and surrounding areas.
Solution Approach 2:
The patent changes the thermal parameters of the dissipating device by using phase change material with high latent heat of fusion. This parameter change allows the material to absorb large amounts of heat during phase transition, effectively distributing heat energy uniformly throughout the device rather than concentrating it in specific areas.
3Power
If high-performance chips are used to increase processing power, then device functionality is improved, but heat generation increases causing overheating
Solution Approach 1:
The phase change material absorbs the excessive heat generated by high-performance chips through its latent heat of fusion during melting. This allows the chip to operate at high power levels without overheating, as the phase change material continuously absorbs heat during the phase transition process, maintaining the chip within safe operating temperatures.
Solution Approach 2:
The composite structure of metal sheet bodies with high thermal conductivity combined with phase change material creates an efficient heat dissipation system. The metal rapidly conducts heat from the chip to the phase change material, which then absorbs and distributes the heat uniformly, enabling high-performance chips to operate without overheating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The phase transition of the thermal conductive fluid enables rapid and efficient heat dissipation, effectively reducing the temperature of electronic devices, even in thin structures, by leveraging the specific gravity difference between the fluid mediums to enhance circulation and convection, thereby preventing overheating.
Implementation Method 1
the thermal conductive fluid will gradually undergo the phase transition, thereby achieving a continuous circulation and flow of the thermal conductive fluid
Implementation Method 2
the phase transition of the thermal conductive fluid enables rapid and efficient heat dissipation, effectively reducing the temperature of electronic devices
Implementation Method 3
using the difference in specific gravity and density to facilitate heat absorption and convection
Implementation Method 4
The thermal conductive fluid is a mixture of two immiscible fluid mediums... leveraging the specific gravity difference between the fluid mediums to enhance circulation and convection
Implementation Method 5
employs two immiscible fluid mediums as a thermal conductive fluid to dissipate heat from an electronic device through the phase transition of the thermal conductive fluid
Data Source
AI summary
A dissipating device applied to an electronic device and configured to absorb the heat source generated by the electronic device. A thermal conductive fluid is filled in the dissipating device of the present disclosure. The thermal conductive fluid is a mixture of two immiscible fluid mediums. When the thermal conductive fluid contacts the heat source of the electronic device, the thermal conductive fluid will continuously undergo a phase transition cycle to speed up the heat dissipation effect of the dissipating device on the electronic device and achieve an excellent heat dissipation effect.