Impact Resistant Structure for Electronic Components

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Solution Overview

Problem

Flexible electronic components are prone to damage from external forces due to inadequate mechanical strength and hardness, leading to reduced reliability during manufacturing, handling, and use.

Innovation Solution

An impact-resistant structure comprising a resistance stack layer and a damping laminate is applied to the electronic component, where the resistance stack layer provides anti-scratch and anti-impact functions on one surface and the damping laminate, with a soft film and support film, buffers impacts on the opposite surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the electronic component is lighted and thinned to improve flexibility, then flexibility is improved, but mechanical strength and hardness deteriorate, making it easily scratched and worn

Engineering Contradiction:

ImproveflexibilityVSAvoidmechanical strength and hardness

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The patent applies composite materials by combining a soft film (polymer material) with a support film (rigid material) to create a damping laminate. This composite structure provides both flexibility and mechanical strength, allowing the electronic component to maintain its thin and flexible nature while gaining enhanced mechanical properties to resist scratching and wear.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The protective layer is segmented into two functional layers: a soft film layer for absorption and cushioning, and a support film layer for structural strength and scratch resistance. This segmentation allows each layer to perform its specific function optimally, with the soft film providing flexibility and impact absorption while the support film provides mechanical strength.

Inventive Principle:

Principle #1Segmentation

2Strength

If a protective layer is added to improve mechanical strength, then strength is improved, but device complexity increases

Engineering Contradiction:

Improvemechanical strengthVSAvoidstructure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent merges the protective functions into a single integrated damping laminate structure that combines both soft film and support film layers. This unified approach consolidates multiple protective functions (impact absorption, scratch resistance, flexibility maintenance) into one component assembly, reducing the need for multiple separate protective layers and simplifying the overall device structure.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The damping laminate serves multiple functions simultaneously: it provides mechanical strength, scratch resistance, impact absorption, and flexibility. By making this single component multi-functional, the patent avoids the need for multiple separate protective layers, thereby reducing device complexity while achieving comprehensive protection.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If a damping laminate with soft film is used to absorb impact, then impact resistance is improved, but hardness deteriorates

Engineering Contradiction:

Improveimpact resistanceVSAvoidhardness

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The patent uses composite materials by combining a soft film (polymer material) with a support film (rigid material) to create a damping laminate. The soft film provides impact absorption and cushioning, while the support film provides structural hardness and scratch resistance, achieving both impact resistance and hardness through material composition.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The damping laminate exhibits local quality differentiation where the soft film region provides impact absorption and cushioning, while the support film region provides structural hardness and scratch resistance. This local quality variation allows different parts of the same component to perform different protective functions, achieving both soft impact absorption and hard scratch resistance.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly reduces damage from scratches and impacts, enhancing the reliability and service life of electronic components by effectively distributing and absorbing external forces.

Implementation Method 1

the damping laminate includes a soft film and a support film. The support film is disposed between the soft film and the electronic component

Methodology Applied

Scientific EffectEnergy absorption through deformation: Deformation

Implementation Method 2

the damping laminate includes a soft film and a support film

Methodology Applied

Scientific EffectMaterial damping: Damping

Data Source

PatentUS11262482B2Impact resistant structure and electronic device

Publication Date: 2022.03.01 HANNSTAR DISPLAY CORP

AI summary

An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.