Impact-Resistant Structure for Flexible Electronic Components
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Solution Overview
Problem
Flexible electronic components, such as flexible SiP, have inadequate mechanical strength and hardness, making them prone to damage from external forces during manufacturing, handling, and use, which decreases their reliability.
Innovation Solution
An impact-resistant structure comprising a resistance stack layer with a Young's modulus between 40 GPa and 150 GPa and a damping laminate with a soft film and a support film is applied to the electronic component, providing anti-scratch and anti-impact protection by distributing stress and absorbing impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible electronic components are thinned and lighted, then flexibility and integration are improved, but mechanical strength and hardness become inadequate, making them prone to damage
Solution Approach 1:
The patent applies composite materials by stacking multiple layers with different mechanical properties: a hard coating layer (silicon oxide, silicon nitride, or diamond-like carbon) provides hardness and scratch resistance, while a soft material layer (polymer or rubber with Young's modulus 0.1-10 GPa) provides flexibility and impact absorption. This composite structure enables the component to simultaneously achieve both flexibility and mechanical strength.
Solution Approach 2:
The patent implements local quality by applying different material properties to different regions of the protective structure. The hard coating layer is applied to the surface where scratch resistance is needed, while the soft material layer is positioned underneath to provide flexibility and cushioning where impact absorption is required. This spatial differentiation of material properties resolves the contradiction between hardness and flexibility.
2Volume of moving object
If the electronic component is thinned, then device integration is improved, but resistance to external forces and damage resistance decrease
Solution Approach 1:
The patent uses composite materials to compensate for the reduced thickness of the electronic component. The multi-layer structure (hard coating layer + soft material layer) provides enhanced protection against external forces, scratches, and impacts, thereby improving reliability despite the thinned design of the underlying electronic component.
Solution Approach 2:
The soft material layer acts as a beforehand cushioning layer that absorbs and dissipates impact energy before it reaches the thinned electronic component. This pre-cushioning mechanism protects the component from damage during handling and use, compensating for the reduced structural integrity due to thinning.
3Strength
If a protective layer is added to enhance mechanical strength, then damage resistance is improved, but device complexity increases
Solution Approach 1:
The patent employs thin film structures for the hard coating layer and soft material layer, which provide protective functions without adding significant bulk or complexity. The thin film approach maintains device simplicity while achieving the desired mechanical strength and flexibility properties.
Solution Approach 2:
The patent optimizes the thickness and material parameters of the protective layers to achieve the required mechanical strength with minimal added complexity. By carefully controlling the Young's modulus, thickness, and material composition of each layer, the protective structure provides enhanced strength while maintaining a simple and manufacturable design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The impact-resistant structure effectively reduces damage from scratches and impacts, enhancing the reliability and service life of electronic components by distributing stress and absorbing impacts, as demonstrated by simulation and experimental results like the pencil drop test.
Implementation Method 1
distributing stress and absorbing impacts
Implementation Method 2
absorbing impacts
Implementation Method 3
The damping laminate includes a soft film and a support film
Data Source
AI summary
An impact resistant structure for an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, a thickness of the resistance stack layer is less than 10 μm, and a Young's modulus of the resistance stack layer is between 40 GPa and 150 GPa. The damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.