Impedance Adjuster RF Plate for Uniform Substrate Deposition
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in achieving uniform material deposition across substrates, as the deposition process can vary significantly at different portions due to uneven electric fields, leading to non-uniform film thickness and pattern formation.
Innovation Solution
Incorporation of impedance adjusters, such as capacitors and inductors, on the RF plate, which allows for adjustable resonance circuits to control the electric field distribution, ensuring uniform deposition by matching the impedance and adjusting the electric field around the susceptor, thereby optimizing the plasma processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a parallel plate structure with RF power applied to the shower plate is used, then plasma is created for material deposition, but non-uniform electric field distribution causes non-uniform film thickness across the substrate
Solution Approach 1:
The RF plate is divided into multiple segments with independent impedance adjustment capabilities. Each segment can have its impedance adjusted independently through variable capacitors or variable inductors, allowing localized control of electric field distribution to achieve uniform plasma density and film thickness across different regions of the substrate
Solution Approach 2:
Different regions of the RF plate are equipped with different impedance adjustment components (variable capacitors or variable inductors) tailored to the specific electric field requirements of each region. This allows each local area to have optimized impedance characteristics, creating uniform electric field distribution and plasma density across the entire substrate surface
2Manufacturing precision
If impedance adjusters are added to the RF plate, then electric field distribution is improved for uniform deposition, but device complexity increases
Solution Approach 1:
The impedance of different regions of the RF plate is adjusted by changing electrical parameters (capacitance or inductance) of adjustable components. Variable capacitors or variable inductors are used to tune the impedance of each segment, allowing precise control of electric field distribution and plasma density without requiring complex mechanical or structural modifications to the RF plate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables more uniform film deposition on substrates by adjusting the impedance of the resonance circuits, ensuring consistent processing results across different areas of the substrate, enhancing the evenness and uniformity of material layers.
Implementation Method 1
the impedance adjustors may be resonance circuits
Implementation Method 2
An RF power is applied to the shower plate via the RF plate 20 and the relay ring 18, creating an RF plasma between the shower plate 14 and the susceptor 10
Implementation Method 3
creating an RF plasma between the shower plate 14 and the susceptor 10
Implementation Method 4
The shower plate 14 is provided with a plurality of holes such that gas is supplied to a substrate placed on the susceptor 10, causing the deposition of a thin film on the substrate
Data Source
AI summary
A substrate processing apparatus is disclosed. An exemplary substrate processing apparatus includes a reaction chamber; a susceptor positioned within the reaction chamber to be constructed and arranged to support a substrate; a shower plate to be constructed and arranged to face the susceptor; and an RF generator electrically coupled to the shower plate via an RF plate, with the susceptor electrically grounded; wherein the RF plate is provided with a plurality of impedance adjusters.