Impedance Conversion Element Routing Pattern Magnetic Coupling
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Solution Overview
Problem
Existing impedance conversion elements face difficulties in providing wide-band matching between antenna elements and power supply circuits due to increased parasitic inductance from long routing wires, which limits impedance matching effectiveness.
Innovation Solution
The impedance conversion element incorporates a multilayer body with laminated insulating layers, featuring a first conductor pattern, a second conductor pattern, and a routing pattern that magnetically couples with both, reducing parasitic inductance and enhancing the impedance conversion ratio by positioning the routing pattern between the conductor patterns in the lamination direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If long routing wires are used to connect coils to antenna terminal, then connection is achieved, but parasitic inductance increases
Solution Approach 1:
The patent transitions from planar routing to three-dimensional routing by utilizing multiple layers of insulating films. The first and second conductor patterns are arranged on different layers, allowing magnetic coupling through the intermediate layer without requiring long wire connections on the same layer. This dimensional change reduces parasitic inductance while maintaining electrical connection.
Solution Approach 2:
The patent introduces a routing pattern as an intermediary element that magnetically couples with both the first conductor pattern and the second conductor pattern. This routing pattern acts as a mediator to transfer energy between the two conductors without requiring direct physical connection, thereby reducing parasitic inductance.
2Device complexity
If parasitic inductance is increased, then routing connection is simplified, but impedance matching bandwidth deteriorates
Solution Approach 1:
By utilizing multiple layers of insulating films to arrange conductor patterns in three-dimensional space, the patent reduces parasitic inductance without complicating the routing structure. The layered arrangement allows direct magnetic coupling between conductors on adjacent layers, achieving wide impedance matching bandwidth while maintaining simple routing connections.
Solution Approach 2:
The patent replaces direct electrical connection through long wires with magnetic coupling between conductor patterns on different layers. This substitution of mechanical/electrical connection with magnetic field interaction reduces parasitic inductance and expands impedance matching bandwidth.
3Reliability
If routing pattern is positioned between conductor patterns in lamination direction, then magnetic coupling is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes the lamination direction (vertical dimension) to position the routing pattern between conductor patterns on different layers. This three-dimensional arrangement enhances magnetic coupling efficiency by placing the routing pattern in the optimal position for flux linkage, while the layered structure remains compatible with standard PCB manufacturing processes.
Solution Approach 2:
The patent divides the impedance conversion element into multiple functional layers: first insulating film, second insulating film, and third insulating film, each containing specific conductor patterns. This segmentation allows independent optimization of each layer's function while maintaining overall manufacturing feasibility through standard multilayer PCB techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for improved impedance matching between antenna and power supply circuits over a wide band, enhancing communication device performance by reducing parasitic inductance and increasing the impedance conversion ratio.
Implementation Method 1
The second conductor pattern magnetically couples with the first conductor pattern
Implementation Method 2
The routing pattern extends to magnetically couple with at least either the first conductor pattern or the second conductor pattern
Data Source
AI summary
A first end of a first conductor pattern of a first coil conductor is connected to a power supply terminal, and a second end of the first conductor pattern is connected to an antenna terminal. A second conductor pattern includes second coil conductors. A first end of the second conductor pattern is connected to the antenna terminal and the second end of the first conductor pattern, and a second end of the second conductor pattern is connected to a ground terminal. The second conductor pattern magnetically couples with the first conductor pattern. The second end of the first conductor pattern and the first end of the second conductor pattern are connected to the antenna terminal via a routing pattern that extends to magnetically couple with at least either the first conductor pattern or the second conductor pattern.