Impedance Matched Electrical Connector With Integrated Passive Elements
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Solution Overview
Problem
Conventional electrical connectors for printed circuit boards lack integrated passive circuit elements, leading to space constraints and undesirable signal reflections due to impedance discontinuities, which affect signal quality and data transmission.
Innovation Solution
The development of an electrical connector featuring wafers with insulative housings and signal conductors that include connection points with widened ends and apertures for mounting passive circuit elements, ensuring impedance matching and efficient signal transmission across a wide frequency range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive circuit elements are added to printed circuit boards to improve signal quality and filtering, then signal transmission quality is improved, but board space is reduced and impedance discontinuities cause signal reflections
Solution Approach 1:
The patent combines passive circuit elements (capacitors, inductors, resistors) directly into the connector assembly by integrating them with signal conductors, eliminating the need for separate board-mounted components. This merging of functions allows the connector to provide both connection and signal conditioning capabilities, resolving the space conflict by consolidating multiple functions into a single component location.
Solution Approach 2:
The patent moves passive circuit elements from the two-dimensional board surface to the three-dimensional connector structure, utilizing the vertical and lateral space within the connector housing. This dimensional transition allows passive elements to be positioned in apertures and along signal paths without consuming additional board surface area.
2Ease of manufacture
If conventional connectors are used to maintain simple structure, then manufacturing cost is reduced, but signal reflections occur due to impedance discontinuities
Solution Approach 1:
The patent applies local quality changes by modifying specific portions of signal conductors at connection points where passive elements are attached. The conductor width is varied locally at these connection points to compensate for impedance changes introduced by the passive elements, while the rest of the conductor maintains its original dimensions. This localized adjustment reduces signal reflections without requiring complete redesign of the entire connector structure.
3Productivity
If connector density is increased to improve signal capacity, then more signals per unit length are achieved, but connector ruggedness and reliability may be compromised
Solution Approach 1:
The patent divides the connector into modular wafer assemblies, each containing multiple signal conductors and integrated passive elements. This segmentation allows for standardized, pre-tested units that can be reliably manufactured and assembled, maintaining ruggedness while achieving high density through the modular architecture.
Data Source
AI summary
An electrical wafer for electrically connecting to a printed circuit board. The electrical wafer includes an insulative housing and at least one signal conductor disposed in the insulative housing. The at least one signal conductor includes an intermediate portion having a connection point. The connection point includes first and second ends, at least one of which has a width greater than a portion of the at least one signal conductor outside the connection point. The insulative housing has at least one aperture exposing at least a portion of the connection point. A portion of the connection point may be punched out, and a passive circuit element may be placed within the at least one aperture and mounted to the connection point. Multiple electrical wafers may be coupled together by a stiffener and connected to a backplane connector.