Impedance Matching Device Using Coupled Wire Bond Resonators
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Solution Overview
Problem
Conventional impedance matching networks require significant space, especially in sub-gigahertz applications and high-power amplifier implementations, where a compact solution is desired to maintain performance and efficiency.
Innovation Solution
An impedance matching device with a parallel-connected prematch network and resonator structure, utilizing inductive coupling through wire bonds to achieve desired mutual inductance and reduce overall package size, while maintaining stability and efficiency across the amplifier's frequency response.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional impedance matching networks utilize combinations of capacitors, inductors, and resistors along with transmission lines, then impedance matching performance is achieved, but the device occupies a relatively large amount of space
Solution Approach 1:
The patent combines the prematch network and resonator structure into a single integrated device with parallel connection, merging multiple functions (impedance matching and harmonic termination) into one compact unit, thereby reducing the overall package space while maintaining performance
Solution Approach 2:
The impedance matching device performs multiple functions simultaneously: it provides impedance matching for the amplifier and incorporates a resonator structure for harmonic termination, making the device multi-functional and reducing the need for separate components
2Reliability
If conventional impedance matching networks incorporate a resonator structure for harmonic termination, then harmonic termination is improved, but the package space requirement increases
Solution Approach 1:
The resonator structure is integrated within the same package as the prematch network, combining harmonic termination functionality with impedance matching in a single compact device, thereby reducing total package volume
3Ease of manufacture
If the prematch network and resonator structure are connected in series, then the circuit implementation is straightforward, but the package size increases
Solution Approach 1:
Instead of the conventional series connection, the patent employs a parallel connection between the prematch network and resonator structure, inverting the traditional topology to achieve compactness while maintaining manufacturability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces package size, minimizes power losses, and maintains amplifier efficiency and stability, allowing for effective impedance matching in compact high-power amplifier designs.
Implementation Method 1
The second inductor is magnetically coupled to the first inductor and has a mutual inductance with the first inductor
Data Source
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AI summary
An impedance matching device is presented. The device includes an input terminal configured to receive a radio frequency signal, and an output terminal configured to couple to an amplifier. The device includes an impedance prematch network coupled to the input terminal and the output terminal. The impedance prematch network includes a first inductor, such as a first wire bond. The device includes a resonator structure including a second inductor, such as a wire bond, inductively coupled to the first inductor.