Integrated Impedance Matching Lead Frame for RF Chip Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional RF products require significant space for bonding and separate impedance matching circuits, leading to increased volume and inefficiency in signal transfer between RF chips and package circuits.
Innovation Solution
A lead frame with integrated impedance matching components, including rectangular-shaped capacitors and inductors made of conductive materials like Cu, Al, or Au, is used to reduce bonding space and perform impedance matching between RF chips and package circuits, with a bending unit forming an obtuse angle cross-section for efficient signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal wire bonding process is used to transfer signals between RF chip and package circuit, then signal transfer is achieved, but bonding space increases leading to larger product volume
Solution Approach 1:
The patent merges the bonding function and impedance matching function into a single integrated structure. The lead frame includes bonding pads for signal transfer and integrated impedance matching circuits (capacitors and inductors formed by conductive patterns) within the same component, eliminating the need for separate bonding wires and discrete matching components, thereby reducing overall volume while maintaining signal transfer capability
Solution Approach 2:
The lead frame structure serves multiple functions simultaneously: it provides mechanical support, enables electrical signal transfer through bonding pads, and performs impedance matching through integrated capacitive and inductive patterns. This multi-functionality eliminates the need for separate components, reducing the number of parts and overall product volume
2Reliability
If a separate impedance matching circuit is adopted, then impedance matching between input and output ports is achieved, but device complexity and volume increase
Solution Approach 1:
The impedance matching circuit is merged with the lead frame structure itself. Capacitive elements are formed by conductive patterns between different bonding pads, and inductive elements are formed by trace geometries, integrating the matching function into the existing bonding infrastructure rather than adding separate components
Solution Approach 2:
The lead frame is designed to perform both signal transmission and impedance matching functions. The same conductive structures that provide electrical connectivity also provide the capacitive and inductive reactances needed for impedance matching, reducing device complexity by eliminating dedicated matching circuit components
Data Source
AI summary
A lead frame for a hermetic RF chip package includes: a first capacitor unit formed of a conductive material in a rectangular shape having a width smaller than a length to receive an input of an RF signal applied to the package circuit; a first inductor unit connected to the first capacitor unit and formed of a conductive material in a rectangular shape having a width greater than a length; a second capacitor unit connected to the first inductor unit and formed of a conductive material in a rectangular shape having a width smaller than a length; and a second inductor unit connected to the second capacitor unit and formed of a conductive material in a rectangular shape having a width greater than a length to transfer an RF signal input through the first capacitor unit to the RF chip.