Impedance Matching Pattern for Millimeter-Wave Signal Reflection

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Solution Overview

Problem

Current semiconductor devices face difficulties in achieving high-speed data transmission beyond 40 GHz frequency due to signal reflection and deterioration, limiting their effectiveness in millimeter-wave frequency bands.

Innovation Solution

Incorporating an impedance matching pattern with a symmetric shape on the transmission line to reduce signal reflection and enhance transmission characteristics, allowing for high-speed data transmission with minimal signal deterioration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional transmission line is used for millimeter-wave signal transmission, then the device structure remains simple, but signal reflection and deterioration occur at frequencies above 40 GHz, limiting transmission effectiveness

Engineering Contradiction:
Improvesignal transmission effectivenessVSAvoidtransmission line structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by introducing an impedance matching pattern with specific geometric features (protrusions and recesses) at particular locations along the transmission line. These localized structural modifications create regions with different impedance characteristics that progressively match the impedance between the circuit board and antenna, reducing signal reflection at the interface without requiring complete redesign of the entire transmission system.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs parameter changes by varying the impedance characteristics along the transmission line through the impedance matching pattern. The pattern includes protrusions and recesses that change the effective width and capacitance of the transmission line at different positions, creating a gradual impedance transition. This allows the transmission line to adapt its electrical parameters to match the antenna impedance, improving signal transmission effectiveness at millimeter-wave frequencies.

Inventive Principle:
Principle #35Parameter changes

2Speed

If the transmission line operates at higher frequencies to achieve high-speed data transmission, then data transmission speed increases, but signal reflection and deterioration worsen, limiting effective transmission range

Engineering Contradiction:
Improvedata transmission speedVSAvoidsignal integrity
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent uses parameter changes by designing the impedance matching pattern to modify the electrical characteristics of the transmission line. The pattern includes protrusions and recesses that change the effective capacitance and impedance at different positions along the transmission line. This gradual parameter variation creates a smooth impedance transition that reduces signal reflection and maintains signal integrity even at high frequencies, enabling high-speed data transmission without sacrificing reliability.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If an impedance matching pattern is added to the transmission line to reduce signal reflection, then signal transmission effectiveness improves, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvesignal transmission effectivenessVSAvoidtransmission line fabrication
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies local quality by implementing the impedance matching pattern as localized protrusions and recesses rather than requiring complete redesign of the entire transmission line. These localized features can be integrated into existing PCB manufacturing processes using standard etching and patterning techniques, minimizing additional manufacturing complexity while achieving the desired impedance matching effect.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent merges the impedance matching function with the existing transmission line structure by integrating the pattern directly into the ground plane or signal trace layer. This combination eliminates the need for separate impedance matching components or additional layers, reducing manufacturing complexity while maintaining the signal transmission effectiveness benefits.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS9748664B2Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
Publication Date: 2017.08.29 SONY GROUP CORP
  • US9748664B2 patent drawing
  • US9748664B2 patent drawing
  • US9748664B2 patent drawing

AI summary

Disclosed herein is a semiconductor device including: a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. An impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line.