Impedance Measurement Substrate Surface Contact
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Solution Overview
Problem
The existing impedance measuring method using a coaxial connector and measurement jig results in increased contact resistance due to point contact with curved external terminal electrodes, leading to poor reproducibility and variation in measurement results.
Innovation Solution
An impedance measuring method using a measurement substrate with first and second conductors on an insulating substrate, housed in a coaxial connector, where the measured electronic component is mounted on the substrate to eliminate contact resistance, with third and fourth conductors ensuring secure surface contact within the connector to minimize measurement variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the measured electronic component is sandwiched between the measurement jig and the biasing attachment jig, then the component can be fixed for measurement, but the contact resistance increases and measurement precision deteriorates
Solution Approach 1:
A measurement substrate is introduced as an intermediary component between the measured electronic component and the measurement system. The substrate has conductors that make surface contact with the component's external terminal electrodes, eliminating the need for direct contact between the measurement jig and the component. This mediator resolves the contradiction by providing reliable fixing through the substrate while minimizing contact resistance at the interface with the component.
Solution Approach 2:
The contact interface is changed from point contact (in the sandwiching method) to surface contact through the measurement substrate. By transitioning from zero-dimensional point contact to two-dimensional surface contact, the contact area is increased, which reduces contact resistance and improves measurement precision while maintaining reliable fixing.
2Device complexity
If point contact is used with curved external terminal electrodes, then the measurement structure is simple, but contact resistance increases and measurement precision deteriorates
Solution Approach 1:
The measurement substrate provides surface contact with the curved external terminal electrodes, transitioning from point contact to surface contact. This increases the contact area and reduces contact resistance without significantly increasing device complexity, as the substrate is a standard PCB-like structure that can be easily manufactured.
Solution Approach 2:
The measurement substrate has conductors with specific local properties designed to match the curved surface of the external terminal electrodes. The conductor geometry and material properties are optimized locally at the contact interface to minimize contact resistance, while the rest of the substrate maintains standard fabrication processes.
3Adaptability or versatility
If the contact condition varies between the measured electronic component and the measurement jig, then the measurement setup is flexible, but contact resistance changes and reproducibility deteriorates
Solution Approach 1:
The measurement substrate serves as a stable intermediary that standardizes the contact interface. By fixing the component to the substrate and making contacts through the substrate's conductors, variations in contact conditions are minimized. The substrate provides a consistent reference plane and contact geometry, improving reproducibility while maintaining adaptability to different component types.
Solution Approach 2:
The measurement substrate provides homogeneous contact conditions across different measurements. The conductor geometry, material properties, and contact pressure are standardized on the substrate, ensuring consistent electrical and mechanical characteristics for each measurement, thereby improving reproducibility.
Data Source
AI summary
An impedance measuring method uses an impedance measuring device for measuring an impedance of a measured electronic component, a coaxial connector electrically connected to the impedance measuring device, and a measurement substrate which can be housed in the coaxial connector. The coaxial connector has a center conductor and an outer conductor located outside the center conductor. The measurement substrate has an insulating substrate and first and second conductors each formed on a first principal surface of the insulating substrate. The measurement substrate with the measured electronic component being mounted on the first and second conductors is housed in the coaxial connector connected to the impedance measuring device, so as to electrically connect the first conductor to the center conductor and electrically connect the second conductor to the outer conductor. Then the impedance of the measured electronic component is measured by the impedance measuring device.