Temperature-Tuned Impedance Member for Edge Ring Plasma Uniformity

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Solution Overview

Problem

Substrate processing apparatuses using plasma face issues with non-uniform plasma distribution due to wear of the edge ring, leading to uneven substrate processing and reduced productivity.

Innovation Solution

Incorporating an impedance adjustment member with a temperature-adjustable dielectric constant, made of materials like magnesium oxide, to control plasma distribution uniformly by varying the dielectric constant based on edge ring corrosion, ensuring consistent plasma density across the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If plasma processing is performed using a conventional edge ring, then substrate processing can be conducted, but the edge ring wears down causing non-uniform plasma distribution and reduced processing quality

Engineering Contradiction:
Improvesubstrate processing uniformityVSAvoidedge ring durability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the physical-chemical parameters of the edge ring by using a composite material containing magnesium oxide with specific weight percentages (10-50 wt%). This material composition change provides both wear resistance and appropriate plasma interaction properties, resolving the contradiction between durability and processing uniformity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The edge ring is constructed as a composite material combining magnesium oxide with other materials in specific proportions. This composite structure provides enhanced wear resistance while maintaining plasma distribution uniformity, simultaneously addressing both reliability and manufacturing precision requirements

Inventive Principle:
Principle #40Composite materials

2Reliability

If the edge ring is made more wear-resistant, then durability improves, but plasma distribution uniformity may deteriorate due to material properties

Engineering Contradiction:
Improveedge ring durabilityVSAvoidplasma distribution uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

By adjusting the magnesium oxide content parameter within the optimal range of 10-50 wt%, the patent achieves a balance where the material is sufficiently wear-resistant while maintaining the electrical and thermal properties needed for uniform plasma distribution

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The composite material formulation allows combining wear-resistant properties from magnesium oxide with other materials that maintain plasma interaction characteristics, achieving both durability and plasma uniformity simultaneously

Inventive Principle:
Principle #40Composite materials

3Productivity

If substrate processing continues without maintenance, then productivity increases, but processing quality deteriorates due to edge ring wear

Engineering Contradiction:
Improveprocessing throughputVSAvoidsubstrate processing uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The enhanced wear resistance of the magnesium oxide composite edge ring enables continuous substrate processing without interruption for maintenance, maintaining both high productivity and processing quality over extended periods

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The improved material properties extend the operational lifecycle of the edge ring, allowing sustained processing operations while maintaining the critical parameters for uniform plasma distribution

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures uniform plasma distribution and improved processing efficiency by actively adjusting the dielectric constant of the impedance adjustment member in response to edge ring corrosion, maintaining consistent plasma density and reducing yield reduction caused by tilting phenomena.

Implementation Method 1

an impedance adjustment member provided below the edge ring, and a temperature adjustment member that variably adjusts temperature of the impedance adjustment member

Methodology Applied
Scientific EffectDielectric constant variation with temperature: Dielectric

Implementation Method 2

The impedance adjustment member may be made of a material, the dielectric constant of which varies according to temperature

Methodology Applied
Scientific EffectTemperature-dependent dielectric property: Dielectric Permittivity

Implementation Method 3

Plasma is generated by heating or subjecting a neutral gas to a strong electric field or a radio frequency (RF) electromagnetic field and refers to an ionized gaseous state of matter containing ions, electrons, and radicals

Methodology Applied
Scientific EffectPlasma generation: Plasma

Implementation Method 4

Plasma is generated by heating or subjecting a neutral gas to a strong electric field or a radio frequency (RF) electromagnetic field and refers to an ionized gaseous state of matter

Methodology Applied
Scientific EffectIonization: Ionisation

Implementation Method 5

a temperature adjustment member that variably adjusts temperature of the impedance adjustment member

Methodology Applied
Scientific EffectThermal control: Heating

Implementation Method 6

The impedance adjustment member may have the highest dielectric constant at a first temperature, an increasing dielectric constant with a temperature rise in a range below the first temperature

Methodology Applied
Scientific EffectThermal expansion/contraction: Thermal Expansion

Data Source

PatentUS11894219B2Method for processing substrate
Publication Date: 2024.02.06 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US11894219B2 patent drawing
  • US11894219B2 patent drawing
  • US11894219B2 patent drawing

AI summary

The inventive concept relates to an apparatus and a method for processing a substrate. In an embodiment, the apparatus includes a process chamber having a processing space inside, a support unit that supports the substrate in the processing space, a gas supply unit that supplies a process gas into the processing space, and a plasma source that generates plasma from the process gas. The support unit includes a support on which the substrate is placed, an edge ring around the substrate placed on the support, an impedance adjustment member provided below the edge ring, and a temperature adjustment member that variably adjusts temperature of the impedance adjustment member.