Impedance Thickness Measurement Without Conductive Paste
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing measurement systems for determining the thickness of a layer in a multi-layer structure require adherent conductive media like silver paste, leading to significant time and labor costs due to delays in achieving stable impedance measurements and the need for post-measurement cleaning.
Innovation Solution
A system and method that directly contacts electrodes with a multi-layer structure at predetermined sampling pressure and temperature, measuring electrical impedance without the use of conductive media, allowing for precise thickness determination of layers like thermally grown oxides in high-temperature components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive media like silver paste is used to electrically couple electrodes to the structure, then electrical contact is achieved, but measurement stability is delayed and post-measurement cleaning is required
Solution Approach 1:
The patent removes the conductive media (silver paste) from the measurement system, replacing it with direct electrode contact to the structure surfaces. This extraction eliminates the drying and stabilization delays associated with paste-based contact while maintaining electrical coupling capability through direct conductive contact.
Solution Approach 2:
The patent introduces a conductive gel as an intermediary substance between the electrodes and structure surfaces. This gel provides immediate electrical contact without requiring drying time, eliminating the measurement delay while still allowing for easy removal without residue or damage to the structure.
2Reliability
If conductive media like silver paste is used to electrically couple electrodes to the structure, then electrical contact is achieved, but post-measurement cleaning labor is required
Solution Approach 1:
The patent eliminates the need for post-measurement cleaning by removing the conductive paste that would otherwise require removal. Direct electrode contact or gel-based contact allows electrodes to be simply removed without leaving residue or requiring cleaning operations.
Solution Approach 2:
The patent employs a disposable conductive gel that can be easily applied and removed without residue. This gel serves its purpose during measurement and then can be completely removed without requiring cleaning equipment or labor, effectively making it a single-use consumable that eliminates the cleaning step.
3Measurement precision
If pressure is applied to achieve stable impedance measurement, then measurement accuracy improves, but structure deformation may occur
Solution Approach 1:
The patent employs temperature control as an additional parameter to achieve stable impedance measurements without increasing pressure. By controlling temperature, the system can obtain reliable measurements while maintaining low contact pressure that prevents structure deformation or damage.
Solution Approach 2:
The patent uses a feedback control system that dynamically adjusts measurement parameters including pressure and temperature. The system monitors impedance stability and automatically adjusts conditions to achieve accurate measurements while maintaining pressure below thresholds that would cause structure deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and timely determination of layer thickness without the need for conductive media, reducing time and labor costs while maintaining precision, applicable to various multi-layer structures including those with thermal barrier coatings.
Implementation Method 1
a pressure control device configured to press the first electrode against the multi-layer structure substantially at a predetermined sampling pressure
Implementation Method 2
a measurement device that is electrically coupled to the first electrode and the second electrode. The measurement device is configured to measure an electrical impedance between the first electrode and the second electrode
Data Source
AI summary
A method for use in determining the thickness of a layer of interest in a multi-layer structure. A first electrode is positioned in contact with a first surface of the multi-layer structure, and a second electrode is positioned in contact with a second surface of the multi-layer structure. The second surface is substantially opposite the first surface. The first electrode is pressed against the multi-layer structure at a predetermined sampling pressure, and the structure is optionally adjusted to a predetermined sampling temperature. The electrical impedance between the first electrode and the second electrode is measured.


