Impinging Jet Cooling with Acoustic Control for Uniform Heat Transfer
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Solution Overview
Problem
Existing cooling techniques for microelectronic devices, such as impinging jet systems, suffer from inefficiencies due to uncontrolled jet oscillations and vortex formation, leading to non-uniform heat transfer and increased costs from large heat spreaders and multiple openings, which can result in reduced cooling effectiveness and higher energy consumption.
Innovation Solution
A controlled jet system is implemented using transducers to perturb the jet flow at specific frequencies, stabilizing the jet's oscillation and aligning vortices to concentrate cooling at targeted areas, thereby achieving uniform cooling while reducing energy usage and minimizing structural requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If uncontrolled impinging jet system is used for cooling microelectronic devices, then the jet can provide cooling to the target, but the jet oscillates and buckles causing non-uniform heat transfer and reduced cooling effectiveness
Solution Approach 1:
The patent applies acoustic vibration through transducers to counteract the natural buckling and oscillation of the impinging jet. By introducing controlled vibrations at specific frequencies, the system stabilizes the jet flow and eliminates the harmful oscillations that cause non-uniform heat transfer, thereby improving cooling effectiveness while maintaining flow stability
Solution Approach 2:
The patent changes the flow parameters of the jet by controlling the inlet velocity and using acoustic forcing at dominant oscillation frequencies. By adjusting these parameters, the system transitions the jet from an unstable, oscillating state to a stable, controlled state that provides uniform cooling across the microelectronic devices
2Temperature
If large heat spreaders and heat sinks are used for cooling microchips, then cooling capacity is improved, but package size increases and functionality is limited
Solution Approach 1:
The patent extracts and removes the large heat spreaders and heat sinks from the cooling system, replacing them with a compact impinging jet system. This extraction eliminates the space-consuming components while maintaining effective cooling through direct jet impingement on the microchips, thereby reducing package size without sacrificing cooling capacity
Solution Approach 2:
The patent uses a pneumatic cooling approach by directing jets of gas (typically air) directly onto the microelectronic devices. This pneumatic system replaces the solid heat spreaders and heat sinks, providing high cooling capacity in a compact form factor that does not limit package size or functionality
3Temperature
If multiple steady impinging jets are used to cool greater areas, then heat transfer coefficient is maintained uniformly, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges multiple cooling functions into a single impinging jet system. By using one jet with acoustic control instead of multiple steady jets, the system achieves uniform heat transfer across the target area while reducing the number of openings and structural components, thereby simplifying device complexity and manufacturing
4Area of stationary object
If multiple openings in material layer are used for multiple jets, then cooling coverage is improved, but manufacturing cost and structural complexity increase
Solution Approach 1:
The patent extracts and eliminates the need for multiple openings in the material layer by using a single opening for the impinging jet. The acoustic control mechanism enables this single opening to provide uniform cooling across the entire target area, significantly simplifying manufacturing and reducing costs while maintaining comprehensive cooling coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The controlled jet system enhances localized and overall cooling efficiency, providing consistent heat transfer across microelectronic devices with reduced power consumption and cost-effective design, as it stabilizes the jet flow to maximize momentum and coolant distribution.
Implementation Method 1
aligning vortices to concentrate cooling at targeted areas
Implementation Method 2
jet flow mode that is unsteady and causes the jet to oscillate and buckle about the axis
Implementation Method 3
Jet is directed toward circuit board, which supports a variety of heat generating elements such as microelectronic devices
Implementation Method 4
enhances localized and overall cooling efficiency, providing consistent heat transfer across microelectronic devices
Data Source
AI summary
A system (50) includes a material layer (52) having an opening (62) extending through it and a pumping device (54) positioned behind the layer (52). A target element (56) is positioned in front of the material layer (52). In a partial cooling mode (124), the pumping device (54) drives a jet (134) of coolant through the opening (62) toward the target (56). Transducers (58, 60), positioned at opposing ends of the opening (62), produce output signals (130, 132) that perturb the jet (134) to partially control its oscillation. The jet (134) spreads from a location (96) on the target element (56) in one direction (142) to provide uniform cooling over a portion (126) of the target element (56) in the direction (142), and the jet (134) non-uniformly spreads in another direction (144) to provide non-uniform cooling over a portion (128) of the target element (56) in the other direction (144).